قدرات تصنيع ثنائي الفينيل متعدد الكلور

Precision Circuit Imaging & Etching Technology

UGPCB Factory demonstrates exceptional process control in circuit patterning and etching. For standard PCB production, we consistently achieve:

• Laser Direct Imaging (LDI) replacing traditional photolithography masks, enabling digital file-based exposure with ±5μm alignment accuracy
• Alkaline etching process ensuring clean line edges with ±15% line width control (industry-leading tolerance)
• Expertise in handling various copper thicknesses (1أوقية-6 أوقية) with minimized side-etching

High-Precision Drilling & Hole Metallization

Our drilling capabilities cover:

• Mechanical drilling for 0.4mm-3.0mm boards with ±0.025mm hole size tolerance
• حفر الليزر down to 0.1mm microvias
• Hole metallization achieving >20μm uniform copper plating through advanced chemical deposition and electroplating
• Special processes for 8:1 ل 10:1 aspect ratio requirements

Multilayer Lamination & Interlayer Alignment

• Up to 100-layer PCB fabrication using FR-4 Grade A materials
• Precision lamination with ±25um layer-to-layer alignment
• Temperature/pressure/time-controlled processes preventing delamination
• Options for high-Tg materials, high-speed laminates, and heavy copper up to 1000μm

قناع اللحام & Surface Finish Options

• Solder mask colors: Green/Blue/Red/Black with 0.08mm minimum solder bridge
• التشطيبات السطحية:
  1. ينزف (Hot Air Solder Leveling)
  2. يوافق (Electroless Nickel Immersion Gold)
  3. Immersion Tin/Silver
  4. OSP (Organic Solderability Preservative)

Comprehensive QC & Testing Systems

• AOI Inspection: High-resolution defect detection for line/space, pads, shorts/opens
• السيطرة على المعاوقة: ±10% tolerance for high-speed/RF applications
• Electrical Testing: مسبار الطيران & fixture-based continuity verification
• Reliability Testing: Thermal shock, humidity resistance, flexural testing

Process Capability & استقرار

• Cpk >1.33 (4σ) across critical processes, reaching 1.67 (5σ) in key areas
• Line width control within ±15% (vs industry 20% معيار)
• Statistical process control (SPC) ensuring consistent production quality

PCBA One-Stop Services

• SMT Assembly: 01005 component handling with ±0.03mm placement accuracy
• Advanced Packaging: BGA/Micro BGA/PoP support with X-ray inspection
• DFM Support: Impedance calculation, stack-up design, manufacturability analysis

تطبيقات الصناعة & اتصال

Serving consumer electronics, industrial controls, telecommunications, الأجهزة الطبية, and automotive sectors with tailored PCB solutions. Visit our website for process capability reports and free DFM consultation.