UGPCB

24-Layer High-Speed Communication Backplane PCB | Panasonic M6 Material

Introduction to the 24 Layers Communication Backplane PCB

ال 24 Layers Communication Backplane PCB is a high-performance لوحة الدوائر المطبوعة designed for complex communication systems. It is engineered to provide robust connectivity and reliable signal transmission, making it ideal for advanced telecommunication applications.

What is a 24 Layers Communication Backplane PCB?

أ 24 Layers Communication Backplane PCB refers to a multilayered printed circuit board that has been specifically designed with 24 layers of conductive material separated by dielectric layers. This structure allows for high-density interconnectivity while maintaining signal integrity and minimizing interference.

Design Requirements

The design requirements for a 24 Layers Communication Backplane PCB are stringent due to its application in critical communication systems. Key design considerations include:

How Does It Work?

ال 24 Layers Communication Backplane PCB works by using multiple layers of copper traces separated by dielectric materials. These layers are interconnected through plated through-holes (PTHs) or vias, allowing signals to travel between different layers. The immersion gold surface treatment ensures that the copper traces remain conductive and resistant to oxidation.

التطبيقات

The primary application of the 24 Layers Communication Backplane PCB is in communication backplanes where high-speed data transmission and reliable connectivity are crucial. These مركبات ثنائي الفينيل متعدد الكلور are used in:

تصنيف

Based on its features and applications, ال 24 Layers Communication Backplane PCB can be classified as a high-multilayer PCB. This classification highlights its capability to handle complex and dense circuit designs required for modern communication systems.

Material Composition

The core material used in the 24 Layers Communication Backplane PCB is Panasonic M6, a high-performance laminate material known for its excellent mechanical, thermal, and electrical properties. This material ensures that the PCB can withstand the demands of high-speed communication applications.

خصائص الأداء

The performance characteristics of the 24 Layers Communication Backplane PCB include:

Structural Details

The structural details of the 24 Layers Communication Backplane PCB are as follows:

Features and Benefits

The key features and benefits of the 24 Layers Communication Backplane PCB include:

Production Process

The production process of the 24 Layers Communication Backplane PCB involves several steps, including:

  1. اختيار المواد: Choosing high-quality Panasonic M6 material.
  2. Layer Stacking: Arranging the 24 layers with precision.
  3. النقش: Removing excess copper to form the desired trace patterns.
  4. تصفيح: Applying immersion gold surface treatment.
  5. Assembly: Incorporating PTHs and vias for layer interconnections.
  6. الاختبار: Ensuring the PCB meets all performance specifications.

Use Cases

ال 24 Layers Communication Backplane PCB is used in various scenarios, such as:

في ملخص, ال 24 Layers Communication Backplane PCB is a sophisticated and reliable component designed to meet the demanding requirements of modern communication systems. Its high-density design, excellent performance characteristics, and robust construction make it an essential part of any advanced telecommunication setup.

Exit mobile version