UGPCB

1.6mm High-Thermal FR-4 Aluminum Base PCB | Single-Side ENIG 2u” | LED Heat Sink Board – UGPCB

Ultimin

High-Thermal FR-4 Single-Side Aluminum Base PCB Product Overview & Definition

In today’s high-power, high-density electronic devices, ال thermal management capability of a لوحة الدوائر المطبوعة (ثنائي الفينيل متعدد الكلور) is critical for product reliability and longevity. UGPCB 1.6mm Single-Side Aluminum Base PCB (1 Layer Aluminum Core PCB) is an innovative solution that combines a high-Tg FR-4 laminate with an integrated thermal management structure. This design achieves an optimal balance between the excellent electrical properties of FR-4, cost-effectiveness, and heat dissipation performance comparable to dedicated Metal Core PCBs (MCPCBs). هذا Thermal Management PCB is specifically engineered to solve cooling challenges in applications like LED lighting and power conversion modules.

High-Thermal FR-4 Single-Side Aluminum Base PCB

المواصفات الأساسية & Technical Classification

Scientific Classification:

  1. By Layer Count: Single-Sided Board.

  2. By Substrate Type: Rigid Composite Metal Core Printed Circuit Board.

  3. By Thermal Performance: High Thermal Conductivity PCB.

  4. By Primary Application: High-Power LED Heat Sink Board, Power Supply Cooling Board.

إرشادات التصميم & Operating Principle

Key Design Considerations:

  1. Heat Source Placement: High-heat-dissipation components (على سبيل المثال, LED chips, power MOSFETs) should be placed on pads directly connected to or in close proximity to the aluminum base thermal pad area to ensure the shortest thermal path.

  2. Electrical Isolation: Although it features a metal base, electrical isolation between the circuit and the metal core is maintained through the FR-4 dielectric layer و thermally conductive insulating layer. Design must ensure the required insulation withstand voltage (typically >2kV) is met.

  3. Copper Weight Selection: Choose appropriate copper foil thickness (standard 1oz/2oz) based on current-carrying requirements. Widen traces or use copper pours for high-current paths.

  4. ENIG Finish Advantage: ال 2u” ENIG surface finish provides excellent flatness and solderability, ideal for fine-pitch SMT components and connectors subject to repeated mating cycles.

Operating Principle:

The core functionality of this لوحة ثنائي الفينيل متعدد الكلور is to utilize the high thermal conductivity of aluminum (approx. 200 W/m·K) to rapidly absorb and spread heat generated by components on the circuit layer. The heat is then dissipated into the environment via the chassis or an external heatsink attached to the board. The structure acts as a “thermal highway,” conducting heat from localized hotspots across the entire metal base area, significantly lowering junction temperatures and enhancing system stability.

مواد, بناء & الميزات الرئيسية

Materials Used:

Board Construction:

The stack-up, from top to bottom, is: White Solder Mask Layer (with Black Legend) -> 2u” ENIG Pads/Traces Layer -> FR-4 Dielectric Insulation Layer -> Aluminum Metal Substrate. This “sandwich” construction ensures optimal electrical performance alongside superior thermal management.

Core Performance & سمات:

  1. Superior Heat Dissipation: Integrated aluminum core provides thermal conductivity far exceeding standard FR-4 PCB boards, effectively reducing component operating temperatures by 20%-40%.

  2. High Reliability: ال FR-4 TG150 material offers enhanced thermal endurance, maintaining mechanical stability in high-temperature environments and minimizing solder joint fatigue from CTE mismatch.

  3. Excellent Solderability: ال Electroless Nickel Immersion Gold (يوافق) finish provides a flat, oxidation-resistant, and highly solderable surface, suitable for fine-pitch components.

  4. Mechanical Robustness: The 1.6mm overall thickness combined with the metal core results in a لوحة ثنائي الفينيل متعدد الكلور with higher mechanical strength, resisting bending and vibration.

  5. Clear Identification: The white-on-black legend printing offers excellent readability during assembly and servicing.

  6. Cost-Effective Solution: Compared to full ceramic substrates or high-end pure aluminum PCBs, this solution provides superior thermal performance while maintaining a competitive تصنيع ثنائي الفينيل متعدد الكلور يكلف.

عملية التصنيع & Key Techniques

UGPCB strictly adheres to معايير IPC. The core manufacturing workflow is as follows:

  1. Panelization & Prep: Cutting the FR-4 and aluminum core laminate material.

  2. Imaging & Pattern Transfer: Transferring the circuit pattern onto the copper layer via photolithography.

  3. النقش: Forming precise copper traces.

  4. حفر (if required): For mounting holes or thermal vias.

  5. قناع اللحام & Legend Application: Coating with white LPI solder mask, followed by exposure, تطوير, and printing of black legend.

  6. الانتهاء من السطح: Applying a precisely controlled Electroless Nickel Immersion Gold process to create nickel and gold layers on exposed pads, ensuring a consistent gold thickness of 2 micro-inches.

  7. Routing & Profiling: Board outline routing or V-scoring.

  8. Electrical Test & التفتيش النهائي: 100% Flying Probe or Fixture testing to ensure circuit continuity and electrical isolation.

التطبيقات الأولية & Use Cases

هذا High-Thermal Single-Side Aluminum Core PCB is the ideal choice for a wide range of medium-to-high power electronic applications requiring efficient cooling:

Why Choose UGPCB’s Aluminum Base PCB Solution?

As a professional الشركة المصنعة لثنائي الفينيل متعدد الكلور, UGPCB not only supplies standard products but also offers customization based on your specific thermal requirements (على سبيل المثال, locally thickened aluminum base), electrical insulation needs, and mechanical form factors. We are committed to supporting your project from initial design review through to volume production, ضمان لوحة ثنائي الفينيل متعدد الكلور quality and on-time delivery.

Contact us today for a free quote and technical consultation on your High-Power Thermal Management PCB Solution. Let our expert design and manufacturing capabilities enhance the reliability and performance of your products.

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