Structure and Composition
Base Plate and Layers
The high-frequency hybrid PCB splint includes a base plate, والتي يتم طيها ووضعها على طبقة السلك الداخلية الأولى, طبقة السلك الخارجي الأولى, and the top surface of the solder mask ink layer from bottom to top in order. The positioning circuit layer, the second outer wire layer, and the bottom surface of the substrate are also part of this structure.
High-Frequency and Auxiliary Areas
The substrate includes a high-frequency area and an auxiliary area. The auxiliary area is fixed, while the inlay in the high-frequency area should be located at a fixed position.
Design and Features
Division of Areas
يوفر نموذج المنفعة جبيرة هجينة عالية التردد, الذي ينقسم إلى قسمين: منطقة عالية التردد ومنطقة مساعدة. This design provides mechanical support.
High-Frequency Materials
The high-frequency area is independently arranged, and only this area is made of high-frequency materials. This minimizes the use of high-frequency board materials while satisfying high-frequency signals, thereby reducing production costs.
Product Specifications
Classification and Layers
- High Frequency Hybrid Product Classification Layers: 6 طبقات
Materials and Dimensions
- Used Board: 4350 مليار ريال عماني + FR4
- سماكة: 1.6مم
- مقاس: 210مم * 280مم
Surface Treatment and Applications
- المعالجة السطحية: Gold-plated
- Minimum Aperture: 0.25مم
- طلب: تواصل
- سمات: High Frequency Mixed Pressure