متعدد الطبقات إصبع الذهب اللوحة الأم التحكم ثنائي الفينيل متعدد الكلور

1. For PCB boards that require frequent insertion and removal, it is generally necessary to harden the gold fingers through a plating process to enhance their wear resistance.
2. The gold fingers need to be angled backwards, typically at 45°. Other angles such as 20°, 30°, إلخ., are also used. If the design does not include this backward angle, there is an issue. As shown in the diagram below, the arrow indicates a 45° back tilt:
3. A complete solder mask window should be created for the gold fingers. No need to open the steel mesh for the pins;
4. The minimum distance between Shenxi and Shenyin pads is 14 مليون. It is recommended that the solder pads are more than 1mm away from the finger position, including through-hole solder pads;
5. Do not apply copper coating on the surface of the gold fingers.