UGPCB

22 Layer High-Performance Megtron-6 PCB | 2.0mm Thick with ENIG Finish | High-Speed & RF Solution – UGPCB

Ultimin

In the era of data-intensive and ultra-high-speed signal transmission, a Printed Circuit Board (ثنائي الفينيل متعدد الكلور) is far more than a simple component carrier; it is the critical architecture defining system performance limits. For demanding applications like high-speed networking, artificial intelligence computing, and advanced test instrumentation, standard FR-4 materials fall short. UGPCB addresses this need with our advanced 22-layer multilayer PCB built on Panasonic Megtron-6 R-5775G laminate, engineered to meet challenges of high frequency, low loss, and complex interconnectivity.

1.UGPCB’s 22-Layer Megtron-6 High-Speed PCB Product Overview & Definition

This product is a 22-layer High-Density Interconnect (مؤشر التنمية البشرية) rigid printed circuit board. Its core advantage lies in the use of a premium-grade, عالية السرعة, low-loss laminate—Panasonic’s Megtron-6 R-5775G. Combined with a robust 2.0mm board thickness and precision lamination technology, it creates a high-end interconnection platform capable of handling high-frequency signals above 10GHz with exceptional signal integrity and power integrity.

UGPCB's 22-Layer Megtron-6 High-Speed PCB

2. اعتبارات التصميم الحرجة

Designing such an advanced multilayer circuit board requires focus on:

  1. السيطرة على المعاوقة: Precise calculation and control of single-ended and differential impedance to ensure consistent signal propagation within the Megtron-6 dielectric.

  2. Stack-up Optimization: The intelligent arrangement of the 22 conductive layers (22طبقات)—including signal, قوة, and ground planes—is crucial for maximizing shielding and minimizing crosstalk in this high-layer count PCB.

  3. الإدارة الحرارية: The 2.0mm board thickness and multilayer structure aid heat distribution. لكن, strategic use of thermal vias remains essential for high-power IC areas.

  4. High-Frequency Routing: Employing microstrip or stripline configurations, avoiding acute angle turns, and leveraging the low-profile copper foil of Megtron-6 to reduce losses from skin effect.

3. How It Works & Structure

أ PCB’s primary function is to provide electrical connectivity and signal transmission between components via etched copper traces on an insulating substrate. هذا 22-layer PCB board structure resembles a precise “multi-layer sandwich”:

4. Core Material: Panasonic Megtron-6 R-5775G

This is the heart of this advanced PCB material. Megtron-6 is Panasonic’s next-generation, عالية السرعة, low-loss circuit board material series.

Item Test method حالة Unit MEGTRON6
R-5775(N)
Low Dk glass cloth		 MEGTRON6
R-5775
Normal glass cloth
Glass transition temp.(تيراغرام) DSC أ °C 185 185
Thermal decomposition temp.(TD) TGA أ °C 410 410
CTE x-axis α1 IPC-TM-650 2.4.24 أ جزء في المليون/درجة مئوية 14-16 14-16
CTE y-axis 14-16 14-16
CTE z-axis α1 IPC-TM-650 2.4.24 أ 45 45
α2 260 260
T288(with copper) IPC-TM-650 2.4.24.1 أ min >120 >120
ثابت العزل الكهربائي(DK) 12GHz Balanced-type
circular disk resonator		 C-24/23/50 － 3.4 3.6
Dissipation factor(ص) 0.004 0.004
Water absorption IPC-TM-650 2.6.2.1 D-24/23 % 0.14 0.14
Flexural modulus Fill JIS C 6481 أ GPa 18 19
قوة قشر* 1أوقية(35ميكرومتر) IPC-TM-650 2.4.8 أ kN/m 0.8 0.8

5. الميزات الرئيسية & Performance

  1. Ultra-Low Signal Loss: Megtron-6 material ensures maximum efficiency in high-frequency signal transmission with minimal attenuation.

  2. Excellent Thermal & Dimensional Stability: High Tg value combined with a 2.0mm thick board suits high-temperature, high-power application environments.

  3. High-Density Interconnect Capability: The 22-layer design provides abundant routing channels, supporting complex interconnections for large-scale chips (على سبيل المثال, FPGAs, GPUs).

  4. Precise Impedance & Layer-to-Layer Registration: Mature manufacturing processes guarantee consistent electrical performance across the ثنائي الفينيل متعدد الكلور متعدد الطبقات.

  5. Superior Solderability & Bonding: The 2u” ENIG finish ensures highly reliable solder joints and is suitable for precision SMT assembly.

6. Scientific Classification & التطبيقات الأولية

7. Production Flow Overview

UGPCB adheres to a stringent PCB manufacturing process to ensure quality:
Material Cutting → Inner Layer Imaging → Lamination (22-طبقة محاذاة & Bonding) → Drilling → Hole Metallization → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing / Scoring → Electrical Testing → Final Inspection (AOL)

Every step is supported by high-precision equipment, with multiple quality control checkpoints integrated into the PCB fabrication process, ensuring this 22-layer Megtron-6 PCB meets the highest standards from design to delivery.

Don’t let base materials limit your innovative designs.
Whether you’re developing next-gen communication hardware or tackling frontier computing challenges, UGPCB 22-layer high-performance PCB solution is your reliable hardware foundation. We provide not just a product, but full-spectrum support from PCB design consultation to rapid prototyping and volume production.

Click to request a quote and receive expert technical documentation. Power your project with a superior core!

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