UGPCB

Rogers PCB RO4350B Printed Circuit Board

Ultimin

Professional 8-Layer Rogers 4350B High-Frequency PCB for Demanding RF & Microwave Applications

In the rapidly advancing fields of wireless communications, الفضاء الجوي, and high-end test instrumentation, standard PCBs fall short of meeting extreme demands for signal integrity, low loss, and thermal stability. UGPCB leverages deep technical expertise to present this 8-Layer High-Frequency PCB built on Rogers 4350B laminate. Engineered to address core challenges in RF applications, it is more than an interconnect—it’s a critical foundation ensuring stable performance and signal purity in advanced electronic systems.

8-Layer Rogers 4350B RF PCB

Product Overview & Definition

This product is an 8-layer rigid high-frequency Printed Circuit Board (ثنائي الفينيل متعدد الكلور), utilizing the industry-recognized premium RF material—روجرز 4350B. Through precision multilayer lamination and specialized processing, it achieves high-density integration of complex RF circuits within a 1.65mm board thickness, delivering superior electrical performance control. It is specifically designed for applications requiring low loss, stable dielectric constant, and excellent thermal management.

Detailed Specifications & Design Considerations

A high-quality ثنائي الفينيل متعدد الكلور starts with precise control over every detail. Below are the core specifications and their design significance:

Parameter Category Specification Design Rationale & Implication
Basic Structure طبقات: 8 طبقات Provides ample routing space, supports separate power, ground, and signal planes—essential for ربط عالية الكثافة (مؤشر التنمية البشرية) و التداخل الكهرومغناطيسي (emi) suppression.
Board Thickness: 1.65مم A balanced thickness ensuring mechanical robustness and heat dissipation while accommodating spatial constraints in assemblies.
Core Material صفح: روجرز 4350B The cornerstone of high-frequency تصميم ثنائي الفينيل متعدد الكلور. Its low dissipation factor (ص) and stable dielectric constant (DK) with minimal variation over frequency/temperature are critical for RF/microwave circuit signal integrity.
Conductivity Copper Weight: Inner 1/1 أوقية, Outer 1/1 أوقية Balanced copper weight ensures consistent current-carrying capacity and impedance control accuracy. 1 oz outer copper aids in heat dissipation.
الانتهاء من السطح يوافق (Electroless Nickel Immersion Gold), 2μ” Provides a flat, highly solderable surface with excellent oxidation resistance, ensuring long-term reliability for RF connectors and BGA assemblies.
Physical Dimensions 280mm x 120mm Suited for medium-sized RF modules or subsystems, balancing integration density and mechanical strength.
Special Processes Depth-Controlled Milling (Step-down) + Blind Vias Key for enhanced spatial efficiency and performance. Step-down milling allows varied board heights; blind vias enable high-density interconnect from surface to inner layers, reducing signal crosstalk—a hallmark of advanced RF PCBs.

Alt tag for suggested technical diagram: Cross-section diagram of 8-layer PCB stackup showing blind vias and step-down milling.

How It Works & التطبيقات الأولية

مبدأ العمل:

At high frequencies (MHz to GHz range), electrical signal transmission behaves more like electromagnetic wave propagation. This PCB leverages the stable dielectric properties of Rogers 4350B to provide a “smooth highway” for these waves, minimizing energy loss (insertion loss) and waveform distortion during transmission. Its precise 8-layer stack-up و blind via design ensure controlled characteristic impedance (على سبيل المثال, 50Ω or 75Ω) for transmission lines while mitigating interlayer signal reflection and crosstalk.

Key Applications:

Scientific Classification

Per industry and IPC standards, this product is classified as a High-Frequency, Multilayer Rigid Printed Circuit Board. More specifically, it is an 8-Layer Metal Core PCB with Blind Vias, fabricated on ceramic-filled hydrocarbon/glass weave reinforced laminate (Rogers 4350B series).

بناء & Key Performance Features

Structural Analysis:

This PCB employs a classic symmetrical stack-up, comprising multiple signal layers with dedicated power and ground planes. Blind vias connect the surface to adjacent inner layers, while through-holes provide interconnection through the entire board. Depth-controlled milling creates mechanical recesses for shield can installation or special assembly requirements.

Outstanding Performance Features:

  1. Ultra-Low Signal Loss: The low dissipation factor of روجرز 4350B at GHz frequencies ensures high-efficiency signal transmission.

  2. Exceptional Electrical Stability: Excellent thermal coefficient of dielectric constant (TCDk) guarantees consistent performance across a wide temperature range.

  3. Superior Thermal Management: معامل منخفض للتمدد الحراري (CTE) and high thermal conductivity enhance reliability in high-power RF circuits.

  4. High-Precision Impedance Control: Achievable tolerance of ±5% or better, thanks to material stability and UGPCB’s advanced process control.

  5. High-Reliability Interconnects: Robust 2μ” ENIG finish and precision blind via technology ensure durable connections in harsh environments.

  6. Enhanced Design Flexibility: The combination of 8 طبقات, blind vias, and step milling supports highly complex and compact RF system design.

Core Manufacturing Process Flow

  1. الإعدادية المادية & Inner Layer Fabrication: Rogers 4350B clad laminates are sheared, drilled (for blind vias), plated, patterned, and etched to form inner layer circuits.

  2. Layup & التصفيح: Etched inner layer cores and prepreg sheets are aligned in the designed stack-up and bonded under high temperature and pressure.

  3. Mechanical Drilling & تصفيح: Through-holes are drilled, followed by electroless and electrolytic copper plating to metallize all holes (PTH and blind vias).

  4. Outer Layer Imaging & تصفيح: Outer layer circuit pattern is applied, followed by pattern plating to build up trace and hole copper thickness.

  5. الانتهاء من السطح: Electroless Nickel Immersion Gold (يوافق) process applied to form a 2-microinch nickel-gold protective layer on pads and hole walls.

  6. CNC Routing & Step Milling: The board outline is routed, و depth-controlled milling creates step-down areas as per design.

  7. Electrical Test & Inspection: 100% electrical test (flying probe or fixture) for continuity and isolation, followed by final QA inspection (including impedance coupon testing).

Typical Use Case Scenarios

Why Choose UGPCB for Your High-Frequency PCB?

Ready to Power Your Next RF Project?

Contact a UGPCB engineer today for a comprehensive DFM review and a competitive quote. Submit your stack-up and impedance requirements to start the conversation.

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