6-Layer HDI Rigid Flex PCB with Blind and Buried Vias
Material Composition
Rigid Insulating Materials
- FR4
- DuPont Polyimide (with good flexural properties)
Rigid Area Thickness
- 0.6مم (provides good strength to the board)
Laminate Sources
- All laminates sourced from authorized dealers under XPCB inspection
الانتهاء من السطح
ENIG Finish
- Advantages:
- Excellent surface flatness
- Good oxidation resistance
- Suitability for movable contacts