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TU-768 High Speed Digital (HSD) PCB Materials

High-Tg and High Thermal Reliability Laminate and Prepreg

Core: TU-768; prepreg: TU-768P

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (الهيئة العربية للتصنيع) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

Main Applications

Key Features

Property

Typical Values Specifications
تيراغرام (DMA) 190°C
تيراغرام (DSC) 180°C
تيراغرام (TMA) 170°C
TD (TGA) 340°C
CTE z-axis (50 ل 260 °C) 2.7%
T-260/ T288 >60 min/ >15 min
Permittivity @1GHz(RC 50%) 4.3
Loss Tangent @1GHz(RC 50%) 0.018

Industry Approvals

Standard Availability

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