UGPCB

12-Layer stimmen PCB zu | High-Reliability FR-4 TU872SLK Multilayer Circuit Board

Ultimin

Professional Product Overview

The UGPCB 12-Layer Rigid PCB is a high-end mehrschichtige Leiterplatte engineered for complex signal transmission, high-density interconnects (HDI), and demanding operating environments. Manufactured with high-performance FR-4 TU872SLK laminate and finished with 2-microinch Immersion Gold (ZUSTIMMEN), this board is a cornerstone solution for industrial control systems, Telekommunikationsinfrastruktur, and advanced computing hardware, offering exceptional electrical performance, long-term reliability, and robust signal integrity.

12-Layer stimmen PCB zu

Product Definition & Einstufung

This product is classified as a High-Layer Count Rigid Printed Circuit Board. It can be further categorized as:

Überlegungen zum kritischen Design

Designing a 12-layer PCB requires meticulous attention to:

  1. Stack-up Design: A rational stack-up sequence (z.B., alternating signal-ground-signal layers) is paramount for impedance control, crosstalk reduction, and Electromagnetic Compatibility (EMC). A proper 12-layer stack-up provides excellent power integrity and signal shielding.

  2. Impedanzkontrolle: For high-speed digital signals (z.B., DDR, PCIE) or RF lines, precise calculation and control of trace characteristic impedance (z.B., 50Ω single-ended, 90Ω/100Ω differential) are essential. We utilize advanced EDA tools and precise process controls to ensure consistency.

  3. Leistung & Ground Plane Management: Solid ground planes and optimized power segmentation ensure low-noise power delivery and clear return paths, which are critical for system stability.

  4. Thermalmanagement: The 1.6mm board thickness and the thermal properties of FR-4 must align with component power dissipation. High-power areas may require thermal vias or integration with external cooling solutions.

Wie es funktioniert

A PCB is a passive platform that provides mechanical support, elektrische Verbindung, and signal transmission pathways for electronic components. This 12-layer PCB facilitates a complete working system by connecting chips, Widerstände, Kondensatoren, usw., through a complex network of etched copper traces. The multilayer architecture allows traces to cross on different layers without interference, significantly increasing circuit complexity and integration density. The ENIG surface finish guarantees reliable solder joints and long-term contact stability.

*(Image Suggestion: Detailed cross-sectional diagram of a 12-layer PCB stack-up)*
*Alt Text: Cross-sectional view of a 12-layer PCB stack-up showing alternating copper layers and dielectric, illustrating complex internal structure for high-density interconnect.*

Konstruktion & Materialien

Schlüsselmerkmale & Leistung

  1. Hohe Zuverlässigkeit: TU872SLK high-Tg material and ENIG finish ensure resistance to high temperatures, Korrosion, and suitability for long-term operation in harsh environments.

  2. Hervorragende Signalintegrität: Rigorous stack-up design and impedance control guarantee high-speed signal quality and lower bit error rates.

  3. Strong Load-Bearing & Thermal Capacity: The 1.6mm thickness offers robust mechanical strength and substantial thermal load management.

  4. Precision Solder Platform: The flat 2μ” ENIG surface is ideal for fine-pitch Komponenten (z.B., BGAs), resulting in strong, reliable solder joints with low defect rates.

  5. Hochdichte Interconnect (HDI): Twelve routing layers support complex, dense circuit designs, enabling reduced product footprint.

Manufacturing Process Flow

Inner Layer Imaging → AOI Inspection → Lamination & Pressing → Drilling → Electroless Copper Deposition → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing & Profiling → Electrical Testing → Final Quality Control (FQC)

Anwendungen & Anwendungsfälle

This PCB is widely used in stability and performance-critical fields:

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