UGPCB

Einseitige Flex-Leiterplatte mit Al-Versteifung | 0.2mm Ultradünn | UGPCB

Ultra-Thin Single-Sided Flex PCB with Aluminum Stiffener Produktübersicht & Definition

In the pursuit of thinner, lighter, and more reliable electronic devices, UGPCB Ultra-Thin Single-Sided Flex Leiterplatte with Aluminum Stiffener represents the optimal fusion of flexible circuit technology and structural reinforcement. This solution is engineered to meet the critical challenge of requiring both dynamic flexibility and localized rigidity, Verbesserte Wärmeabteilung, and superior dimensional stability within constrained spaces.

This product is scientifically classified as a: Single-Sided, Adhesive-Based Flexible Printed Circuit (FPC) with a Localized Aluminum Stiffener. It features a standard single-sided FPC construction with a precisely bonded aluminum alloy stiffener in specific zones, creating a cost-effective “rigid-flex-like” performance where it matters most.

 UGPCB reinforced flexible PCB surface

Schlüsselspezifikationen

Design-Grundlagen & Structure Analysis

Successful aluminum stiffener FPC design begins with precise application analysis. Design engineers must define:

  1. Stiffener Placement: Accurately identify areas for connector mounting, Komponentenplatzierung, or mechanical fastening.

  2. Dynamic Flex Zone Planning: Ensure bending occurs only in designated flexible areas, avoiding the stiffener to maximize flex life.

  3. Thermal Management Path: Utilize the aluminum’s high thermal conductivity by connecting copper pads under heat-generating Komponenten (z.B., LEDs, ICs) directly to the stiffener, creating an efficient heat-spreading pathway.

  4. Toleranz & Registration: Strictly control the alignment tolerance between the stiffener and the FPC to ensure accurate mounting hole placement.

Wie es funktioniert & Performance Advantages

Der PCB with aluminum stiffener operates on a simple yet effective principle:

Core Features & Vorteile:

Herstellungsprozess & Qualitätskontrolle

UGPCB employs a mature flex circuit stiffener attachment process ensuring precision and reliability:

  1. FPC Fabrication: Processing of adhesive-based laminate (z.B., Shengyi) through patterning, Radierung, and drilling.

  2. Oberflächenbearbeitung: Application of OSP coating to exposed copper pads.

  3. Präzisionslaminierung: Bonding of the pre-cut aluminum stiffener to the FPC using controlled heat and pressure with adhesive (pre-preg or base material adhesive layer).

  4. Contour Routing & Profilierung: Final board outline, stiffener shape, and mounting holes are created via CNC or laser cutting.

  5. Umfassende Tests: Includes electrical testing (Flying Probe/Fixture), dimensional AOI, and peel strength tests for the stiffener bond.

Primäranwendungen & Anwendungsfälle

Das ultra-thin flex PCB with metal stiffener is ideal for:

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