Overview of the 62-Layer ATE Load PCB
The 62-Layer ATE Load PCB is a high-performance, ultra-high-density Leiterplatte engineered for Automated Test Equipment (ASS) Systeme. Designed to handle complex signal routing and high-power loads, it meets rigorous testing requirements in semiconductor manufacturing and advanced electronics validation.
Key Definition
An ATE Load PCB is a specialized circuit board that simulates real-world operating conditions for testing integrated circuits (ICs) Und elektronische Komponenten. The 62-layer configuration supports intricate signal paths, power distribution, and thermal management in compact designs.
Critical Design Parameters
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Schichtzahl: 62 layers for multi-domain signal isolation and power plane optimization.
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Abmessungen: 16.9″ × 22.9″ (large format for multi-device integration).
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Dicke: 250 Mil (balances rigidity and thermal dissipation).
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Material: FR4 HTG (high-temperature glass epoxy for stability up to 180°C).
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Mindestlochgröße: 8 Mil (supports high-density interconnects).
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BGA -Tonhöhe: 0.65mm (enables fine-pitch component mounting).
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Seitenverhältnis: 32:1 (ensures reliable plating in microvias).
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Drill-to-Copper: 7 Mil (prevents short circuits).
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POFV & Back-Drilling: Eliminates signal distortion in high-frequency applications.
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Oberflächenbeschaffung: Eneg (Electroless Nickel Electroless Gold for corrosion resistance).
Core Functionality
Der Leiterplatte routes test signals between ATE systems and devices under test (DUTs), ensuring accurate voltage/current measurements. Back-drilling removes unused via stubs to minimize signal reflections, while POFV (Plated Over Filled Vias) enhances thermal conductivity and structural integrity.
Primäranwendungen
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Halbleitertests: Validates ICs, CPUs, and memory modules.
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Luft- und Raumfahrt & Verteidigung: Mission-critical avionics and radar systems.
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Telecom Infrastructure: High-speed data transmission equipment.
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Medizinprodukte: Precision diagnostic and imaging tools.
Material Advantages
FR4 HTg provides:
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Thermische Widerstandsfähigkeit: Stable performance under cyclic thermal stress.
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Niedriger dielektrischer Verlust: Critical for high-frequency signal integrity.
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Mechanische Stärke: Resists warping during multilayer lamination.
Strukturelle Merkmale
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Hybrid Stackup: Combines high-speed, Leistung, and ground layers.
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Microvia -Technologie: Laser-drilled microvias (8 Mil) enable dense interlayer connections.
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Controlled Impedance Traces: Minimizes crosstalk in 0.65mm BGA layouts.
Performance Highlights
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Signalintegrität: <3% insertion loss at 10 GHz.
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Power Handling: Supports 20A per power plane.
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Thermalmanagement: 1.2 W/mK thermal conductivity via POFV.
Fertigungsworkflow
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Material Prep: Cut FR4 HTg cores and prepreg sheets.
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Laserbohren: Create 8-mil microvias with ±1 mil tolerance.
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Überzug & POFV: Electroplate vias and fill with conductive epoxy.
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Back-Drilling: Remove excess via stubs using depth-controlled drills.
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Laminierung: Press 62 layers under high temperature/pressure.
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Oberflächenbeschaffung: Apply ENEG for solderability and oxidation resistance.
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Testen: Validate impedance, continuity, and thermal cycling.
Ideal Use Cases
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High-Frequency ATE Systems: Tests 5G RF components and millimeter-wave devices.
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Multi-Site Testing: Parallel validation of 16+ DUTs on a single board.
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Harsh Environments: Oil/gas exploration sensors and automotive ECU testing.