6L 2+N+2 HDI WiFi Module PCB

HDI PCB (2+N+2) Merkmale

Enhanced Capabilities for BGAs

• Smaller Ball Pitch and Higher I/O Count: Suitable for BGAs with these specifications.

Increased Routing Density

• Complex Designs: Enhances routing density in intricate designs.

Blattfähigkeit

• Sheet Handling: Offers robust sheet capability.

Materialqualität

• Lower Dk/Df Material: Provides better signal transmission performance.

Kupfergefüllte Vias

• Conductive Pathways: Utilizes copper filled vias for improved electrical conductivity.

Anwendungen

Mobile Geräte

• Mobiltelefone: Ideal for advanced smartphones.
• PDAs: Suitable for personal digital assistants.

Computing Devices

• UMPCs: Perfect for ultra-mobile personal computers.

Gaming and Imaging

• Tragbare Spielekonsolen: Enhances the performance of handheld gaming devices.
• Digital Cameras and Camcorders: Ideal for high-resolution imaging equipment.