In the era of data-intensive and ultra-high-speed signal transmission, a Printed Circuit Board (Leiterplatte) is far more than a simple component carrier; it is the critical architecture defining system performance limits. For demanding applications like high-speed networking, artificial intelligence computing, and advanced test instrumentation, standard FR-4 materials fall short. UGPCB addresses this need with our advanced 22-layer multilayer PCB built on Panasonic Megtron-6 R-5775G laminate, engineered to meet challenges of high frequency, low loss, and complex interconnectivity.
1.UGPCB’s 22-Layer Megtron-6 High-Speed PCB Produktübersicht & Definition
This product is a 22-layer High-Density Interconnect (HDI) rigid printed circuit board. Its core advantage lies in the use of a premium-grade, hohe Geschwindigkeit, low-loss laminate—Panasonic’s Megtron-6 R-5775G. Combined with a robust 2.0mm board thickness and precision lamination technology, it creates a high-end interconnection platform capable of handling high-frequency signals above 10GHz with exceptional signal integrity and power integrity.
2. Überlegungen zum kritischen Design
Designing such an advanced mehrschichtige Leiterplatte requires focus on:
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Impedanzkontrolle: Precise calculation and control of single-ended and differential impedance to ensure consistent signal propagation within the Megtron-6 dielectric.
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Stapeloptimierung: The intelligent arrangement of the 22 conductive layers (22Schichten)—including signal, Leistung, and ground planes—is crucial for maximizing shielding and minimizing crosstalk in this high-layer count PCB.
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Thermalmanagement: The 2.0mm board thickness and multilayer structure aid heat distribution. Jedoch, strategic use of thermal vias remains essential for high-power IC areas.
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High-Frequency Routing: Employing microstrip or stripline configurations, avoiding acute angle turns, and leveraging the low-profile copper foil of Megtron-6 to reduce losses from skin effect.
3. Wie es funktioniert & Struktur
A PCB’s primary function is to provide electrical connectivity and signal transmission between components via etched copper traces on an insulating substrate. Das 22-Layer -PCB -Platine structure resembles a precise “multi-layer sandwich”:
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Innere Schichten: Use H/HOZ (etwa 1/1 oz or 35µm) copper for core power, ground planes, and some internal signal routing.
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Außenschichten: Verwenden 1/1 oz copper for mounting primary components and routing critical signal traces.
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Dielectric Layers: All insulating prepreg materials are Panasonic Megtron-6 R-5775G, whose low Dielectric Constant (Dk) und Dissipationsfaktor (Df) ensure superior high-speed signal transmission.
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Oberflächenbeschaffung: Elektrololes Nickel -Eintauchgold (ZUSTIMMEN) bei 2 Mikrozoll (2u”). This provides a flat, solderable surface, excellent oxidation resistance, and good wire-bonding capability, ideal for high-density BGA packages and RF connectors.
4. Kernmaterial: Panasonic Megtron-6 R-5775G
This is the heart of this advanced PCB material. Megtron-6 is Panasonic’s next-generation, hohe Geschwindigkeit, low-loss circuit board material series.
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Key Performance: Features an extremely low Dielectric Constant (Dk~3.5) and ultra-low Dissipation Factor (Df~0.0015 @ 10GHz), significantly outperforming standard FR-4. Its high Glass Transition Temperature (Tg) ensures superior thermal stability and dimensional consistency during high-temperature reflow soldering processes.
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Application Fit: Optimized for high-speed digital signals (10Gbps+ to 56/112Gbps) and millimeter-wave RF applications.
| Artikel | Testmethode | Zustand | Einheit | Megtron6 R-5775(N) Low DK Glass Tuch |
Megtron6 R-5775 Normales Glas Tuch |
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| Glasübergangstemperatur.(Tg) | DSC | A | °C | 185 | 185 | |
| Wärmezersetzungstemp.(Td) | TGA | A | °C | 410 | 410 | |
| CTE x-Achse | A1 | IPC-TM-650 2.4.24 | A | ppm/° C. | 14-16 | 14-16 |
| Cte y-Achse | 14-16 | 14-16 | ||||
| CTE Z-Achse | A1 | IPC-TM-650 2.4.24 | A | 45 | 45 | |
| A2 | 260 | 260 | ||||
| T288(mit Kupfer) | IPC-TM-650 2.4.24.1 | A | min | >120 | >120 | |
| Dielektrizitätskonstante(Dk) | 12GHz | Ausgeglichener Typ Rundscheibe Resonator |
C-24/23/50 | － | 3.4 | 3.6 |
| Dissipationsfaktor(Df) | 0.004 | 0.004 | ||||
| Wasseraufnahme | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.14 | 0.14 | |
| Biegermodul | Füllen | Jis c 6481 | A | GPA | 18 | 19 |
| Schälfestigkeit* | 1oz(35μm) | IPC-TM-650 2.4.8 | A | kN/m | 0.8 | 0.8 |
5. Schlüsselmerkmale & Leistung
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Ultra-Low Signal Loss: Megtron-6 material ensures maximum efficiency in high-frequency signal transmission with minimal attenuation.
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Excellent Thermal & Dimensionsstabilität: High Tg value combined with a 2.0mm thick board suits high-temperature, high-power application environments.
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High-Density Interconnect Capability: The 22-layer design provides abundant routing channels, supporting complex interconnections for large-scale chips (z.B., FPGAs, GPUs).
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Precise Impedance & Layer-to-Layer Registration: Mature manufacturing processes guarantee consistent electrical performance across the mehrschichtige Leiterplatte.
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Superior Solderability & Bindung: The 2u” ENIG finish ensures highly reliable solder joints and is suitable for precision SMT assembly.
6. Wissenschaftliche Klassifikation & Primäranwendungen
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Wissenschaftliche Klassifikation:
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Für Schichtzahl: High Multilayer PCB (Typischerweise >10 Schichten).
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Durch Material: Hochgeschwindigkeits-PCB / Hochfrequenz-PCB / Low-Loss PCB.
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Nach Technologie: HDI PCB (Subject to specific design features like blind/buried vias).
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By Rigidity: Starre PCB.
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Primäranwendungen & Anwendungsfälle:
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High-Speed Networking Equipment: Core backplanes and motherboards for 400G/800G optical modules, high-end routers, and switches.
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Advanced Computing & Lagerung: AI server boards, Hochleistungs-Computing (HPC) clusters, enterprise SSD controller boards.
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Luft- und Raumfahrt & Radarsysteme: RF front-ends and signal processing units for avionics communication and phased array radar systems.
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Advanced Test & Measurement Instruments: Mainboards within high-speed oscilloscopes, spectrum analyzers, and signal generators.
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7. Production Flow Overview
UGPCB adheres to a stringent PCB manufacturing process to ensure quality:
Material Cutting → Inner Layer Imaging → Lamination (22-Schichtausrichtung & Bindung) → Drilling → Hole Metallization → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing / Scoring → Electrical Testing → Final Inspection (AOL)
Every step is supported by high-precision equipment, with multiple quality control checkpoints integrated into the PCB fabrication process, ensuring this 22-layer Megtron-6 PCB meets the highest standards from design to delivery.
Don’t let base materials limit your innovative designs.
Whether you’re developing next-gen communication hardware or tackling frontier computing challenges, UGPCB 22-layer high-performance PCB solution is your reliable hardware foundation. We provide not just a product, but full-spectrum support from PCB design consultation to rapid prototyping and volume production.
Click to request a quote and receive expert technical documentation. Power your project with a superior core!