UGPCB RO4350B + IT180-Mix-Laminat-Hochfrequenz-Leiterplatte

Produktübersicht

Der RO4350B + IT180-Mix-Laminat-Hochfrequenz-Leiterplatte represents an advanced engineered solution from UGPCB. This product combines Rogers RO4350B high-frequency material with IT180 epoxy laminate in a single 6-layer structure. It delivers excellent signal integrity for RF and microwave applications while optimizing manufacturing costs .

This hybrid construction uses Rogers RO4350B for critical high-frequency signal layers. IT180 provides mechanical support and handles digital/power distribution. The result is a high-performance board that meets the demanding requirements of modern communication systems.

Produktspezifikationen

*Tisch: Complete technical specifications for UGPCB RO4350B+IT180 hybrid high frequency PCB*

What Is a Hybrid Laminate High Frequency PCB?

A hybrid laminate Hochfrequenz -PCB uses two or more different material types within a single board structure. This approach allows designers to place the right material in the right location based on electrical and mechanical requirements .

UGPCB’s 6-layer board features:

• Rogers RO4350B on outer layers for high-frequency signal transmission

• IT180 on inner layers for structural integrity and cost management

• Precise impedance control bei 50 ohm throughout all signal paths

This material combination leverages the strengths of each substrate while minimizing their individual limitations.

Material Properties and Performance

Rogers RO4350B Characteristics

RO4350B is a glass-reinforced hydrocarbon/ceramic laminate. It offers:

• Stabile Dielektrizitätskonstante (DK 3.48) across frequency and temperature

• Low signal loss for RF and microwave applications

• Consistent impedance control for 50 ohm designs

• Excellent processability similar to standard FR-4 materials

• Reliable performance up to 10 GHz and beyond

IT180 Laminate Characteristics

IT180 is a high-performance epoxy material with:

• High glass transition temperature (Tg 180°C)

• Excellent thermal stability for lead-free assembly

• Good mechanical strength and rigidity

• Compatible CTE with RO4350B for reliable hybrid construction

• Cost-effective solution for non-critical layers

Thermalmanagement

The board achieves 0.69 W/m.k thermal conductivity. This ensures effective heat dissipation from power amplifiers and RF components. Proper thermal management extends product lifetime and maintains stable electrical performance under load .

Design Principles

Layer Stack-Up Strategy

The 6-layer construction follows these principles:

• Schicht 1-2: RO4350B material for high-frequency signal routing

• Schicht 3-4: IT180 for power distribution and ground planes

• Schicht 5-6: IT180 for additional signal routing and mechanical stability

This arrangement places RF signals close to the surface with controlled dielectric thickness of 0.508 mm. It provides optimal conditions for 50 ohm transmission line design .

HDI Blind Via Design

Das Board verfügt über 1L~2L HDI Blindlöcher. These laser-drilled microvias:

• Connect layer 1 directly to layer 2 without drilling through the entire board

• Reduce signal path length for better high-frequency performance

• Enable higher component density on the surface

• Maintain signal integrity by minimizing via stubs

Impedanzkontrolle

Precise 50 Ohm Impedanzkontrolle is maintained throughout all signal layers. This is achieved through:

• Accurate dielectric constant (DK 3.48) of RO4350B material

• Controlled trace width and spacing based on 0.508 mm dielectric thickness

• Consistent copper thickness of 1 OZ (35 μm)

• Careful design of transitions and via structures

Arbeitsprinzip: How Materials Work Together

Signal Transmission in Hybrid Structures

High-frequency signals travel primarily on the outer layers where RO4350B is present. This material’s stable DK value of 3.48 ensures:

• Consistent signal velocity across the board

• Minimal phase distortion in RF paths

• Reliable impedance matching for 50 ohm systems

• Reduced insertion loss compared to standard materials

Thermal and Mechanical Roles

The IT180 layers serve critical support functions:

• They provide mechanical rigidity to prevent board warpage

• They conduct heat away from active components

• They maintain dimensional stability during assembly

• They offer cost savings without compromising RF performance

Layer-to-Layer Communication

Signals move between layers through:

• Blind Vias for high-frequency paths (L1-L2)

• Buried vias for inner layer connections

• Through-hole vias for power and ground distribution

This multi-level interconnect strategy preserves signal quality while enabling complex routing .

Herstellungsprozess

Schritt 1: Materialvorbereitung

RO4350B and IT180 laminates are cut to panel size. Copper foil and prepreg materials are prepared according to the stack-up design. All materials are baked to remove moisture before processing .

Schritt 2: Inner Layer Imaging

Inner layers are imaged with circuit patterns. Etching removes unwanted copper. Automatisierte optische Inspektion (AOI) verifies pattern accuracy .

Schritt 3: Layer Lamination

RO4350B and IT180 layers are stacked in the correct sequence. Vacuum lamination applies heat and pressure. The hybrid materials bond together to form a single 6-layer structure. Precise temperature control prevents material separation .

Schritt 4: Bohren

Laser drilling creates 1L~2L blind vias with high precision. Mechanical drilling forms through-holes for other connections. Desmear processes clean all drilled holes .

Schritt 5: Überzug

Electroless copper deposits a thin conductive layer. Electrolytic copper plating builds up to 1 OZ (35 μm) Dicke. This ensures reliable electrical connections through all vias .

Schritt 6: Outer Layer Imaging

Outer layers are imaged and etched. Final circuit patterns include fine-pitch features for modern components. AOI verifies outer layer quality .

Schritt 7: Lötmaskenanwendung

Solder mask is applied to protect copper surfaces. It is imaged to expose pads for soldering. Thermal curing hardens the mask .

Schritt 8: Surface Finish – Immersion Gold

Immersionsgold is applied to exposed copper areas. This finish provides:

• Excellent solderability for assembly

• Flat surface for BGA and fine-pitch components

• Corrosion resistance for long-term reliability

• Good performance for high-frequency skin effect

Schritt 9: Elektrische Tests

100% electrical testing verifies:

• Continuity of all nets

• Isolation between nets

• Impedance control at 50 Ohm

• No shorts or opens

Schritt 10: Final Inspection and Packaging

Finished boards are visually inspected. They are vacuum-sealed with moisture barrier bags. Desiccant and humidity indicators are included for safe shipping .

![UGPCB technician inspecting hybrid PCB with immersion gold finish under magnification]
(Alt tag: Quality inspection of UGPCB RO4350B IT180 hybrid PCB with immersion gold surface finish)

Applications and Use Cases

Wireless Communication Equipment

This PCB is ideal for:

• 5G Basisstationen requiring stable RF performance

• Radio frequency modules mit 50 ohm interface requirements

• Wireless infrastructure operating at microwave frequencies

• Antenna systems needing consistent dielectric properties

Radarsysteme

The board supports:

• Automotive radar for ADAS applications

• Millimeter-wave radar Sensoren

• Surveillance radar signal processing

• Marine radar electronics requiring high reliability

High-Speed Data Transmission

Applications include:

• Data center switches with high-speed SerDes interfaces

• Network routers requiring signal integrity

• Optische Transceiver for telecommunications

• High-performance computing interconnects

Luft- und Raumfahrt und Verteidigung

The material combination suits:

• Satellite communication subsystems

• Avionics requiring thermal stability

• Military radio Ausrüstung

• Navigationssysteme in extreme environments

Test und Messung

Typical uses:

• RF test equipment Schnittstellen

• Spectrum analyzers front-end circuits

• Signal generators output stages

• Impedance analyzers test fixtures

Why Choose UGPCB’s Hybrid Solution?

Kostenoptimierung

Using RO4350B only where needed reduces material costs by 30-40% compared to full-RO4350B construction. IT180 provides mechanical strength at lower cost .

Performance Balance

The board delivers RF-grade performance on critical layers. It maintains standard material economy for non-critical sections. This balance suits modern mixed-signal designs .

Manufacturing Reliability

UGPCB’s hybrid lamination expertise ensures:

• No delamination between dissimilar materials

• Consistent impedance across all boards

• Reliable HDI blind via connections

• Flat, warp-free finished boards

Qualitätssicherung

• 100% electrical testing before shipment

• Strict impedance control verification

• Immersion gold for long-term reliability

• Experienced engineering support

Einstufung

This product belongs to the following PCB categories:

*Tisch: Scientific classification of UGPCB RO4350B+IT180 hybrid high frequency PCB*

Technical Data Summary

Tisch: Comprehensive technical data for RO4350B and IT180 hybrid construction

Frequently Asked Questions

Q: What is the main advantage of using hybrid materials?
A: Hybrid construction places RO4350B only on high-frequency layers. This reduces material costs while maintaining RF performance. IT180 provides mechanical strength at lower cost .

Q: Can this board support 50 ohm impedance requirements?
A: Ja. The board is designed for strict 50 ohm impedance control. Dielectric thickness of 0.508 mm and DK 3.48 enable precise trace width calculations .

Q: What is the purpose of HDI blind vias?
A: 1L~2L blind vias connect the top layer directly to layer 2. This shortens signal paths and improves high-frequency performance. It also enables higher component density .

Q: Is immersion gold suitable for high-frequency applications?
A: Ja. Immersion gold provides excellent surface flatness. It supports the skin effect at high frequencies. It also offers long shelf life and good solderability .

Q: What is the thermal conductivity value?
A: The board achieves 0.69 W/m.k thermal conductivity. This helps dissipate heat from power amplifiers and RF components .

Q: How does this compare to full RO4350B construction?
A: This hybrid approach costs 30-40% less than full RO4350B. It maintains RF performance on critical layers. Mechanical strength is actually improved by IT180’s rigidity .

Ordering Information

UGPCB offers complete support for your hybrid PCB requirements:

• Quick Turnaround: Prototype quantities in 10 working days

• Volume Production: Consistent quality for mass production runs

• Engineering Support: DFM feedback before manufacturing

• Quality Guarantee: 100% electrical test, impedance verified

How to Order

1. Send your Gerber files to UGPCB

2. Specify RO4350B + IT180 hybrid construction

3. Indicate 6-layer, 1.5 mm Dicke, 1 Oz Kupfer

4. Request 50 ohm impedance control and 1L-2L HDI blind vias

5. Choose immersion gold surface finish

6. Receive engineering review within 24 Std.

7. Approve and begin production

Get Your Quote Today

Ready to start your next high-frequency project with UGPCB?

Our team of RF PCB specialists is ready to assist you. We provide:

• Free DFM analysis

• Competitive pricing for prototypes and production

• Fast turnaround times

• Expert technical support

[Contact Our Engineering Team]

E-Mail: sales@ugpcb.com
Website: www.ugpcb.com

UGPCB – Your Trusted Partner for High Frequency Hybrid PCB Solutions