UGPCB

Rogers PCB RO4350B Druckenschaltplatte

Ultimin

Professional 8-Layer Rogers 4350B High-Frequency PCB for Demanding RF & Microwave Applications

In the rapidly advancing fields of wireless communications, Luft- und Raumfahrt, and high-end test instrumentation, Standard-Leiterplatten fall short of meeting extreme demands for signal integrity, low loss, and thermal stability. UGPCB leverages deep technical expertise to present this 8-Layer High-Frequency PCB built on Rogers 4350B laminate. Engineered to address core challenges in RF applications, it is more than an interconnect—it’s a critical foundation ensuring stable performance and signal purity in advanced electronic systems.

8-Layer Rogers 4350B RF PCB

Produktübersicht & Definition

This product is an 8-layer rigid high-frequency Printed Circuit Board (Leiterplatte), utilizing the industry-recognized premium RF material—Rogers 4350b. Through precision multilayer lamination and specialized processing, it achieves high-density integration of complex RF circuits within a 1.65mm board thickness, delivering superior electrical performance control. It is specifically designed for applications requiring low loss, stable dielectric constant, und hervorragendes Wärmemanagement.

Detailed Specifications & Konstruktionsüberlegungen

A high-quality Leiterplatte starts with precise control over every detail. Below are the core specifications and their design significance:

Parameter Category Spezifikation Design Rationale & Implication
Basic Structure Schichten: 8 Schichten Provides ample routing space, supports separate power, ground, and signal planes—essential for Hochdichte Interconnect (HDI) Und Elektromagnetische Interferenz (EMI) suppression.
Brettdicke: 1.65mm A balanced thickness ensuring mechanical robustness and heat dissipation while accommodating spatial constraints in assemblies.
Kernmaterial Laminieren: Rogers 4350b The cornerstone of high-frequency PCB-Design. Its low dissipation factor (Df) and stable dielectric constant (Dk) with minimal variation over frequency/temperature are critical for RF/microwave circuit Signalintegrität.
Leitfähigkeit Kupfergewicht: Innere 1/1 oz, Outer 1/1 oz Balanced copper weight ensures consistent current-carrying capacity and impedance control accuracy. 1 oz outer copper aids in heat dissipation.
Oberflächenbeschaffung ZUSTIMMEN (Elektrololes Nickel -Eintauchgold), 2μ” Provides a flat, highly solderable surface with excellent oxidation resistance, ensuring long-term reliability for RF connectors and BGA assemblies.
Physical Dimensions 280mm x 120mm Suited for medium-sized RF modules or subsystems, balancing integration density and mechanical strength.
Besondere Prozesse Depth-Controlled Milling (Step-down) + Blind Vias Key for enhanced spatial efficiency and performance. Step-down milling allows varied board heights; blind vias enable high-density interconnect from surface to inner layers, reducing signal crosstalk—a hallmark of advanced RF PCBs.

Alt tag for suggested technical diagram: Cross-section diagram of 8-layer PCB stackup showing blind vias and step-down milling.

Wie es funktioniert & Primäranwendungen

Arbeitsprinzip:

At high frequencies (MHz to GHz range), electrical signal transmission behaves more like electromagnetic wave propagation. This PCB leverages the stable dielectric properties of Rogers 4350B to provide a “smooth highway” for these waves, minimizing energy loss (Einfügedämpfung) and waveform distortion during transmission. Its precise 8-Schichtaufbau Und blind via design ensure controlled characteristic impedance (z.B., 50Ω or 75Ω) for transmission lines while mitigating interlayer signal reflection and crosstalk.

Key Applications:

Wissenschaftliche Klassifikation

Per industry and IPC standards, this product is classified as a Hochfrequenz, Multilayer Rigid Printed Circuit Board. More specifically, es ist ein 8-Layer Metal Core PCB with Blind Vias, fabricated on ceramic-filled hydrocarbon/glass weave reinforced laminate (Rogers 4350B series).

Konstruktion & Key Performance Features

Structural Analysis:

This PCB employs a classic symmetrical stack-up, comprising multiple signal layers with dedicated power and ground planes. Blind Vias connect the surface to adjacent inner layers, während through-holes provide interconnection through the entire board. Depth-controlled milling creates mechanical recesses for shield can installation or special assembly requirements.

Outstanding Performance Features:

  1. Ultra-Low Signal Loss: The low dissipation factor of Rogers 4350b at GHz frequencies ensures high-efficiency signal transmission.

  2. Exceptional Electrical Stability: Excellent thermal coefficient of dielectric constant (TCDk) guarantees consistent performance across a wide temperature range.

  3. Überlegenes Wärmemanagement: Niedriger Koeffizient der thermischen Expansion (CTE) and high thermal conductivity enhance reliability in high-power RF circuits.

  4. High-Precision Impedance Control: Achievable tolerance of ±5% or better, thanks to material stability and UGPCB’s advanced process control.

  5. High-Reliability Interconnects: Robust 2μ” ENIG finish and precision blind via technology ensure durable connections in harsh environments.

  6. Enhanced Design Flexibility: The combination of 8 Schichten, blind vias, and step milling supports highly complex and compact RF system design.

Core Manufacturing Process Flow

  1. Material Prep & Inner Layer Fabrication: Rogers 4350B clad laminates are sheared, gebohrt (for blind vias), plated, patterned, and etched to form inner layer circuits.

  2. Layup & Laminierung: Etched inner layer cores and prepreg sheets are aligned in the designed stack-up and bonded under high temperature and pressure.

  3. Mechanical Drilling & Überzug: Through-holes are drilled, followed by electroless and electrolytic copper plating to metallize all holes (PTH and blind vias).

  4. Outer Layer Imaging & Überzug: Outer layer circuit pattern is applied, followed by pattern plating to build up trace and hole copper thickness.

  5. Oberflächenbeschaffung: Elektrololes Nickel -Eintauchgold (ZUSTIMMEN) process applied to form a 2-microinch nickel-gold protective layer on pads and hole walls.

  6. CNC Routing & Step Milling: The board outline is routed, Und depth-controlled milling creates step-down areas as per design.

  7. Elektrische Prüfung & Inspektion: 100% electrical test (flying probe or fixture) for continuity and isolation, followed by final QA inspection (including impedance coupon testing).

Typical Use Case Scenarios

Why Choose UGPCB for Your High-Frequency PCB?

Ready to Power Your Next RF Project?

Contact a UGPCB engineer today for a comprehensive DFM review and a competitive quote. Submit your stack-up and impedance requirements to start the conversation.

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