Ultra-Thin 0.30mm High-Frequency PCB | 2-Layer Rogers R04003 Board with ENIG | UGPCB

Ultra-Thin High-Frequency PCB: 0.30mm Thick 2-Layer Rogers R04003 Produktübersicht & Definition

Das Ultra-Thin High-Frequency PCB aus UGPCB is a double-sided printed circuit board manufactured using Rogers R04003 high-frequency laminate. Engineered for electronic devices with stringent demands on size, Gewicht, and RF performance, this board excels in radio frequency (Rf), microwave communication, and high-speed digital applications. Its core advantage lies in the combination of an extremely thin profile (0.30mm) Und superior dielectric properties, making it a critical component for device miniaturization and enhanced performance.

Technische Spezifikationen & Einstufung

• Einstufung: High-Frequency/Microwave Leiterplatte, Ultra-Thin PCB

• Schichten: 2 Schichten (Double-Sided PCB)

• Brettdicke: 0.30 mm

• Grundmaterial: Rogers R04003 Laminate (0.2mm core, built up to final thickness)

• Kupfergewicht (Finished): 1oz / 1oz (ca. 35μm per side)

• Oberflächenbeschaffung: Elektrololes Nickel -Eintauchgold (ZUSTIMMEN), 2μ”

• Abmessungen: 124.45 mm x 39.69 mm

Materialien & Leistungseigenschaften

• Laminieren: Rogers Ro4003c laminate is used, featuring a stable dielectric constant (Dk ~3.0) and a very low dissipation factor (Df). This is essential for Hochfrequenzschaltungsbretter to minimize signal loss and ensure signal integrity.

• Kupferfolie: Standard 1oz (35μm) electro-deposited copper, offering excellent conductivity and current-carrying capacity.

• Oberflächenbeschaffung: ZUSTIMMEN (2μ”) bietet eine Wohnung, lötbar, and oxidation-resistant surface. The thin gold layer is particularly suitable for RF and microwave PCBs, minimizing signal attenuation due to the skin effect at high frequencies.

Struktur, Design & Manufacturing Key Points

1. Struktur: Standard 2-layer board structure with plated through-holes (PTH) Für die Konnektivität zwischen den Schichten.

2. Überlegungen zum kritischen Design:

   • Impedanzkontrolle: Precise controlled impedance PCB design is crucial. Trace width/spacing must be carefully calculated based on the Dk of RO4003 and the 0.30mm dielectric thickness to achieve target impedance values (z.B., 50Oh).

   • Thermalmanagement: The thin profile offers a short path for heat dissipation. Layout of high-power components must be planned accordingly.

   • Mechanical Handling: The 0.30mm thickness offers flexibility but requires careful handling and support during assembly to prevent bending or damage.

3. Production Process Flow:
   Material Preparation → Inner Layer Imaging → Lamination (RO4003 core with prepreg) → Drilling → Desmear & Electroless Copper Deposition → Outer Layer Imaging & Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing / Profiling to 124.45x39.69mm → Electrical Testing (Flying Probe) → Final Inspection & Packaging

Wie es funktioniert & Schlüsselmerkmale

A Hochfrequenz-Leiterplatte acts as a “highway” for signal transmission, ensuring minimal loss, Verzerrung, and delay. Der Rogers RO4003 material Und precision impedance-controlled design are fundamental to this performance.

Wichtige Produktmerkmale:

• Excellent High-Frequency Performance: The low-loss characteristics of RO4003 laminate enhance RF circuit efficiency and Signalintegrität.

• Extremely Thin and Lightweight: The 0.30mm thin core PCB profile saves critical space and aids in product lightweighting.

• Hohe Zuverlässigkeit & Lötbarkeit: The ENIG finish ensures long-term shelf life, excellent solder joint reliability, and a flat surface for fine-pitch components.

• Precision Manufacturing: Fabricated to exact dimensions (124.45×39.69mm) for reliable integration into compact assemblies.

Primäranwendungen & Anwendungsfälle

Das ultra-thin Rogers PCB is ideal for:

• RFID Modules: Antenna and Leiterplatten in compact readers.

• Satellite Communication & GPS Devices: Miniaturized receiver modules.

• Automotive Radar Sensors: Antenna boards for 77GHz radar systems.

• High-End Test & Messgeräte: Probes and signal acquisition boards.

• Portable Communication Devices & Uavs: RF front-end modules where size and weight are critical.

Why Choose UGPCB for Your Ultra-Thin High-Frequency PCB?

Succeeding in competitive RF and high-speed markets requires a PCB partner with deep expertise. UGPCB provides a complete solution, aus Hochfrequenz PCB-Design Unterstützung Zu high-reliability manufacturing compliant with IPC standards. Every 0.30mm thin PCB we produce undergoes rigorous impedance testing and quality checks, guaranteeing performance in real-world applications.

For your microwave antenna board oder high-speed transmission module, trust UGPCB to deliver superior Signalintegrität and power efficiency. We specialize in RF circuit board fabrication Und microwave PCB manufacturing.

Contact us today for a quote on your high-frequency PCB project.