F4BME-2-A Teflon PCB Glass Fabric Copper-Clad Laminates
F4BME-2-A Teflon PCB glass fabric copper-clad laminates are manufactured using imported woven glass fabric, Teflon PCB resin, and filler with a Nano-ceramic membrane. This product adheres to scientific formulations and stringent technological processes, utilizing low roughness copper foil. It surpasses the F4BM series in electrical performance and surface insulation resistance stability, boasting a higher intermodulation index than F4BME-1/2.
Technische Spezifikationen
Aussehen: Meets the specification requirements for microwave PCB laminates according to National and Military Standards.
Types:
- F4BME-2-A255
- F4BME-2-A262
- F4BME-2-A275
- F4BME-2-A285
- F4BME-2-A294
- F4BME-2-A300
Dimensions (mm):
- 550*440
- 500*500
- 600*500
- 650*500
- 1000*850
- 1100*1000
- 1220*1000
- 1500*1000
Custom dimensions are available upon request.
Thickness and Tolerance (mm):
| Laminate Thickness | Toleranz |
|---|---|
| 0.254 | ±0.025 |
| 0.508 | ±0.05 |
| 0.762 | ±0.05 |
| 0.787 | ±0.05 |
| 1.016 | ±0.05 |
| 1.27 | ±0.05 |
| 1.524 | ±0.05 |
| 2.0 | ±0.075 |
| 3.0 | ±0.09 |
| 4.0 | ±0.1 |
| 5.0 | ±0.1 |
| 6.0 | ±0.12 |
| 9.0 | ±0.18 |
| 10.0 | ±0.18 |
| 12.0 | ±0.2 |
Mechanische Stärke:
- Schneiden/Stanzen:
- Dicke <1mm: Keine Grat nach dem Schneiden; minimum space between two punching holes is 0.55mm, Keine Delaminierung.
- Dicke >1mm: Keine Grat nach dem Schneiden; minimum space between two punching holes is 1.10mm, Keine Delaminierung.
- Schalenstärke (1oz copper):
- Normal state: ≥14N/cm; No bubble or delamination peel strength: ≥12N/cm (under constant humidity and temperature, kept in melting solder at 265°C ±2°C for 20 Sekunden).
Chemical Property: The chemical etching method for PCB can be used without altering the dielectric properties of the laminate. Plating through holes requires sodium treatment or plasma treatment.
Electrical Property:
| Name | Test Condition | Einheit | Wert |
|---|---|---|---|
| Dichte | Normal state | g/cm³ | 2.1～2.35 |
| Moisture Absorption | Dip in distilled water at 20±2°C for 24 Std. | % | ≤0.07 |
| Operating Temperature | High-low temperature chamber | °C | -50°C～+260°C |
| Wärmeleitfähigkeit | W/m/k | 0.45~0.55 | |
| CTE (typical) | -55～288°C (εr :2.5~2.9) | ppm/° C. | X: 16, Y: 20, Z: 170 |
| CTE (typical) | -55～288°C (εr :2.9~3.0) | ppm/° C. | X: 12 Y: 15 Z: 90 |
| Shrinkage Factor | 2 hours in boiling water | % | <0.0002 |
| Oberflächenwiderstand | DC, 500V, Normal state | Mω | ≥4*10^5 |
| Volumenwiderstand | Normal state | Mω · cm | ≥6*10^6 |
| Surface dielectric strength | d=1mm(Kv/mm) | ≥1.2 | |
| Dielektrizitätskonstante | 10GHz | See table below | |
| Dissipationsfaktor | 10GHz | See table below | |
| PIMD (2.5GHz) | db | -160 |
UL Flammability Rating: 94 V-0
For more information or to place an order, please visit our website www.ugpcb.com or contact us via email at sales@ipcb.com.
UGPCB Products:
UGPCB offers a wide range of products including:
- Radio/Microwave/Hybrid High Frequency FR4 Double/Multi-Layer 1~3+N+3 HDI, Anylayer HDI, Rigid-Flex, Blind Buried Slotted, Backdrilled IC Heavy Copper Board, und mehr.
If you have any questions or need further assistance, please do not hesitate to contact us through our website or send an inquiry directly to sales@ugpcb.com.