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F4t-1/2 isolatives Teflon gewebter Glasstoff mit Kupferlaminaten

F4T-1/2: A High-Performance Circuit Baseplate for Microwave PCBs

F4T-1/2 is a specialized circuit baseplate constructed from insulative Teflon PCB, featuring electrolytic copper foil on both sides. The material undergoes high-temperature and high-pressure treatment to ensure optimal performance. This product boasts superior electrical properties, such as low dielectric constant and minimal loss, coupled with excellent mechanical strength, making it an ideal choice for Microwave PCB applications.

Technische Spezifikationen

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Dimensions (mm)

Dicke und Toleranz

Mechanische Eigenschaften

Chemische Eigenschaften

Elektrische Eigenschaften

Name Test Conditions Einheit Specification
Gravity Normaler Zustand g/cm³ 2.2–2.3
Water absorption rate Dip in distilled water at 20±2°C for 24h % ≤0.01
Operating temperature High-low temp chamber °C -100~+150
Thermal conductivity coefficient Kcal/m.h.°C 0.4
Coefficient of thermal expansion Temp rise 96°C/hr *1 9.8–10*10^-5
Shrinkage factor 2 hours boiling water % 0.0005
Surface insulation resistance 500In DC, normal state ≥1*10⁷
Konstante Luftfeuchtigkeit und Temperatur ≥1*10⁵
Volume resistance Normaler Zustand Mω.cm ≥1*10¹⁰
Konstante Luftfeuchtigkeit und Temperatur Mω.cm ≥1*10⁷
Pin resistance 500In DC, normal state ≥1*10⁵
Konstante Luftfeuchtigkeit und Temperatur ≥1*10⁵
Surface dielectric strength Normaler Zustand δ=1mm(kV/mm) ≥1.5
Konstante Luftfeuchtigkeit und Temperatur δ=1mm(kV/mm) ≥1.4
Permittivity 10GHz εr 2.2(± 2%)
Dielectric loss angle tangent 10GHz Tgside ≤1*10^-3

This comprehensive overview highlights F4T-1/2’s technical prowess, ensuring it meets stringent industry standards for microwave PCB baseplates.

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