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TU-768 Hochgeschwindigkeit digital (HSD) PCB -Materialien

High-Tg and High Thermal Reliability Laminate and Prepreg

Kern: TU-768; Prepreg: TU-768P

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) Verfahren. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

Main Applications

Schlüsselmerkmale

Property

Typical Values Spezifikationen
Tg (DMA) 190°C
Tg (DSC) 180°C
Tg (Tma) 170°C
Td (TGA) 340°C
CTE Z-Achse (50 Zu 260 °C) 2.7%
T-260/ T288 >60 min/ >15 min
Permittivity @1GHz(RC 50%) 4.3
Loss Tangent @1GHz(RC 50%) 0.018

Industry Approvals

Standard Availability

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