---
title: "Capacidades de fabricación de PCB estándar"
id: "8682"
type: "page"
slug: "standard-pcb-manufacturing-capabilities"
published_at: "2025-09-02T03:33:55+00:00"
modified_at: "2025-12-22T10:35:04+00:00"
url: "https://www.ugpcb.com/capacity/pcb-fabrication/pcb-manufacturing/standard-pcb-manufacturing-capabilities/"
markdown_url: "https://www.ugpcb.com/capacity/pcb-fabrication/pcb-manufacturing/standard-pcb-manufacturing-capabilities.md"
excerpt: "Precision Circuit Imaging & Etching Technology UGPCB Factory demonstrates exceptional process control in circuit patterning and etching. For standard PCB production, we consistently achieve: Imágenes directas láser (LDI) replacing traditional photolithography masks, enabling digital file-based exposure with ±5μm alignment accuracy..."
---

## Precision Circuit Imaging & Etching Technology

UGPCB Factory demonstrates exceptional process control in circuit patterning and etching. For standard PCB production, we consistently achieve:

- **[Imágenes directas láser](https://www.ugpcb.com/why-us/pcb-equipment/ldi/) (LDI)** replacing traditional photolithography masks, enabling digital file-based exposure with ±5μm alignment accuracy
- **Alkaline etching process** ensuring clean line edges with ±15% line width control (industry-leading tolerance)
- Expertise in handling various copper thicknesses (1oz-6oz) with minimized side-etching

## High-Precision Drilling & Hole Metallization

Our drilling capabilities cover:

- **Mechanical drilling** for 0.4mm-3.0mm boards with ±0.025mm hole size tolerance
- [Perforación láser](https://www.ugpcb.com/why-us/pcb-equipment/pcb-laser-drilling-machine/) down to 0.1mm microvias
- **Hole metallization** achieving >20μm uniform copper plating through advanced chemical deposition and electroplating
- Special processes for 8:1 a 10:1 aspect ratio requirements

## Multilayer Lamination & Interlayer Alignment

- Up to 100-layer PCB fabrication using FR-4 Grade A materials
- Precision lamination with ±15um layer-to-layer alignment
- Temperature/pressure/time-controlled processes preventing delamination
- Options for high-Tg materials, high-speed laminates, and heavy copper up to 1000μm

## Solder Mask & Surface Finish Options

- **Solder mask colors**: Green/Blue/Red/Black with 0.08mm minimum solder bridge
- **Surface finishes**:
  1. HASL (Nivelación de soldadura por aire caliente)
  2. ACEPTAR (Oro de inmersión de níquel químico)
  3. Immersion Tin/Silver
  4. OSP (Conservante de soldabilidad orgánico)

## Comprehensive QC & Testing Systems

- **AOI Inspection**: High-resolution defect detection for line/space, almohadillas, shorts/opens
- **Impedance Control**: ±10% tolerance for high-speed/RF applications
- **Electrical Testing**: Flying probe & fixture-based continuity verification
- **Reliability Testing**: Choque térmico, humidity resistance, flexural testing

## Process Capability & Stability

- **Cpk >1.33** (4a) across critical processes, reaching 1.67 (5a) in key areas
- Line width control within ±15% (vs industry 20% estándar)
- Statistical process control (SPC) ensuring consistent production quality

## PCBA One-Stop Services

- [SMT Assembly](https://www.ugpcb.com/product-category/pcb-assembly/) : 01005 component handling with ±0.03mm placement accuracy
- **Advanced Packaging**: BGA/Micro BGA/PoP support with X-ray inspection
- **DFM Support**: Impedance calculation, diseño de apilamiento, manufacturability analysis

## Industry Applications & Contact

Serving consumer electronics, controles industriales, telecommunications, dispositivos medicos, and automotive sectors with tailored PCB solutions. Visit our website for process capability reports and free DFM consultation.

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