2-PCB de capa FR-4 | 1.6mm de espesor, HASL sin plomo | Prototipo & Production – UGPCB

High-Performance FR-4 Double-Sided PCB Descripción general del producto & Definición

Este 2-Layer Rigid Placa de circuito impreso (tarjeta de circuito impreso) from UGPCB is a fundamental and widely used electronic interconnect solution. It features a standard 1.6mm board thickness, dimensions of 224.02mm x 189mm, and utilizes high-grade KB FR-4 laminate. This double-sided PCB serves as the essential “backbone” for electronic designs, providing reliable electrical connections and mechanical support for components. It is an ideal, cost-effective choice for a vast range of industrial control, electrónica de consumo, and power supply applications.

Consideraciones críticas de diseño

Successful design of a double-sided PCB requires balancing electrical performance with manufacturability. Key considerations include:

• Routing Strategy: Efficiently utilize both top and bottom layers for trace routing. Plated Through-Holes (PTHs or Vias) enable inter-layer connections. Careful planning of trace density is crucial to prevent signal integrity issues like crosstalk.

• Hole & Pad Design: Specify appropriate drill sizes and pad diameters for all PCB vias and component leads to ensure mechanical strength and soldering reliability, adhiriéndose a Normas IPC for annular ring.

• Fuerza & Planos de tierra: While dedicated planes are absent, designers should widen power and ground traces or implement a gridded copper pour to reduce impedance and enhance stability—a key aspect of robust diseño de PCB.

• Design Rule Check (República Democrática del Congo): Prior to fabrication, rigorously verify that all parameters (trace width/clearance, hole sizes) align with the manufacturer’s capabilities (as per this board’s specs) to guarantee PCB design for manufacturability (DFM).

Principio de trabajo & Estructura

The functionality of this double-layer circuit board stems from its layered structure:

1. Construcción: The core consists of an FR-4 insulating dielectric layer, clad with copper foil (típicamente 1 onz) on both sides. The unwanted copper is etched away during fabricación de PCB, forming the desired circuit traces.

2. Electrical Interconnection: Circuits on the two layers are connected vertically via Plated Through-Holes (PTH), created through mechanical drilling followed by electroless and electrolytic copper deposition.

3. Surface Protection: El Nivelación de soldadura por aire caliente sin plomo (HASL) finish applied to exposed copper pads prevents oxidation and ensures excellent solderability for component assembly.

Product Classification & Materiales

Per the provided specifications, this product is accurately classified as follows:

• Por recuento de capas: PCB de doble cara o 2-PCB de capa.

• Por rigidez del sustrato: PCB rígido.

• Por material base: FR-4 PCB. Específicamente, FR-4 from the “KB” brand, an epoxy glass laminate known for superior electrical insulation, resistencia mecánica, and flame retardancy (UL94-V0).

• By Surface Finish: Lead-Free HASL PCB.

• By Application Complexity: Estándar, General-Purpose Industrial-Grade PCB.

Actuación & Características clave

Leveraging the specified materials and processes, this PCB delivers the following core performance benefits:

• Reliable Mechanical & Rendimiento eléctrico: El KB FR-4 material offers stable dielectric constant and low dissipation factor for signal integrity. The 1.6mm standard thickness provides excellent resistance to bending and vibration.

• Dependable Interconnections: El Lead-Free HASL surface finish provides a flat, highly solderable coating compatible with both wave soldering and hand soldering processes.

• Superior Thermal Stability: FR-4 substrate withstands standard soldering temperatures and offers a high continuous operating temperature, suitable for most industrial electronics entornos.

• High Cost-Effectiveness: Compared to multi-layer boards, double-sided PCBs offer significantly lower PCB fabrication cost and shorter lead times, representing an economical hardware solution.

• Cumplimiento ambiental: El HASL sin plomo process complies with international directives such as RoHS.

Detailed Manufacturing Process

UGPCB adheres to a stringent, high-standard PCB manufacturing process:

1. Engineering & CAM: Gerber file analysis, DFM check, and photoplot generation.

2. Panelization: Cutting the large FR-4 laminado revestido de cobre into production panels.

3. Perforación: CNC drilling of component holes and PCB vias.

4. Hole Metallization: Desmear, chemical copper deposition, and electrolytic copper plating to form conductive Plated Through-Holes (PTH).

5. Patterning: Aplicando fotorresistente, exposición, development to transfer the circuit image.

6. Aguafuerte: Removing unwanted copper to form precise circuit traces.

7. Máscara de soldadura & Platina: Applying LPI solder mask (typically green) and legend printing.

8. Acabado superficial: Applying HASL sin plomo coating to exposed pads.

9. Routing & Prueba eléctrica: Profiling to final board outline and performing Electrical Test (Sonda voladora or Fixture Test).

10. Inspección final & Embalaje: Comprehensive Inspección óptica automatizada (AOI), dimensional verification, and vacuum-sealed, moisture-proof packaging.

Aplicaciones primarias & Casos de uso

This specification of double-sided FR-4 PCB is widely deployed in reliable and cost-sensitive aplicaciones:

• Industrial Control Systems: PLC controllers, motor drive boards, sensor interface modules.

• Power Supply Units: Switch-mode power supplies (SMPS), UPS systems, LED driver boards.

• Electrónica de Consumo: Appliance control boards (AC, washing machines), smart home controllers, equipo de audio.

• Electrónica automotriz: Body control modules (BCM), lighting controllers, non-critical infotainment systems.

• Telecommunications Equipment: Functional modules within routers, interruptores.

• Prueba & Measurement Instruments: Data acquisition and display panels for equipment.

Why Choose UGPCB for Your Double-Sided PCB Needs?

Partnering with UGPCB guarantees:

• Precision Manufacturing: Strict adherence to 1.6mm thickness, 224.02x189mm dimensions, y FR-4 material presupuesto.

• Process Excellence: Standardized Lead-Free HASL PCB production ensures batch-to-batch consistency and reliability.

• Expert Technical Support: Our team provides comprehensive support, de diseño de PCB revisar to production consultation.

• Fast Turnkey Delivery: We offer competitive lead times for standard double-layer PCB prototypes and production runs.

Ready to start your project? Contact UGPCB today for a competitive quote and expert support. Let us be your trusted fabricante de PCB and partner for success.