Increase Routing Density in Complex Designs
Sheet Capability
Lower Dk/Df Material for Better Signal Transmission Performance
Copper Filled Vias
Aplicaciones
- Teléfonos móviles
- PDAS
- UMPCs
- Portable Game Consoles
- Digital Cameras
- Camcorders
8-Diseño de PCBA HDI de capa 2+N+2
