Site icon UGPCB

Diseño de PCB de alta velocidad y alta frecuencia

Structure and Composition

Base Plate and Layers

La férula híbrida de alta frecuencia incluye una placa base, que está doblado y colocado en la primera capa de cable interno, la primera capa de alambre exterior, and the top surface of the solder mask ink layer from top to bottom in order from bottom to top. The second layer of the solder resist ink layer is also present.

Substrate Divisions

El sustrato incluye un área de alta frecuencia y un área auxiliar. El área auxiliar finalmente se fija, y la incrustación en el área de alta frecuencia debe ubicarse en una posición fija.

Utility Model and Design

High-Frequency Area and Auxiliary Area

El modelo de utilidad proporciona una férula híbrida de alta frecuencia, que se divide en dos partes: un área de alta frecuencia y un área auxiliar. It provides mechanical support.

Material Usage

The high-frequency area is independently arranged, and only the high-frequency area is made of high-frequency materials. Under the condition of satisfying high-frequency signals, the use of high-frequency board materials is minimized, and the production cost is reduced.

Product Specifications

Classification and Layers

Board Material and Thickness

Size and Surface Treatment

Minimum Aperture and Application

Características

Exit mobile version