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F4T-1/2 Insulative teflon woven glass fabric copper-clad laminates

F4T-1/2: A High-Performance Circuit Baseplate for Microwave PCBs

F4T-1/2 is a specialized circuit baseplate constructed from insulative Teflon PCB, featuring electrolytic copper foil on both sides. The material undergoes high-temperature and high-pressure treatment to ensure optimal performance. This product boasts superior electrical properties, such as low dielectric constant and minimal loss, coupled with excellent mechanical strength, making it an ideal choice for Microwave PCB applications.

Especificaciones técnicas

Apariencia

Dimensiones (milímetros)

Espesor y tolerancia

Mechanical Properties

Chemical Properties

Electrical Properties

Nombre Test Conditions Unidad Especificación
Gravity estado normal gramos/cm³ 2.2–2.3
Water absorption rate Dip in distilled water at 20±2°C for 24h % ≤0.01
Operating temperature High-low temp chamber °C -100~+150
Thermal conductivity coefficient Kcal/m.h.°C 0.4
Coefficient of thermal expansion Temp rise 96°C/hr *1 9.8–10*10^-5
Shrinkage factor 2 hours boiling water % 0.0005
Surface insulation resistance 500V DC, normal state ≥1*10⁷
Humedad y temperatura constantes. ≥1*10⁵
Volume resistance estado normal MΩ.cm ≥1*10¹⁰
Humedad y temperatura constantes. MΩ.cm ≥1*10⁷
Pin resistance 500V DC, normal state ≥1*10⁵
Humedad y temperatura constantes. ≥1*10⁵
Surface dielectric strength estado normal δ=1mm(kV/mm) ≥1.5
Humedad y temperatura constantes. δ=1mm(kV/mm) ≥1.4
Permittivity 10GHZ εr 2.2(±2%)
Dielectric loss angle tangent 10GHZ tgδ ≤1*10^-3

This comprehensive overview highlights F4T-1/2’s technical prowess, ensuring it meets stringent industry standards for microwave PCB baseplates.

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