Pre Tg: IPC-TM-650 2.4.24, Before Tg, ppm/Degree Celsius, 55
Post Tg: IPC-TM-650 2.4.24, After Tg, ppm/Degree Celsius, 308
50-260 Degree Celsius: %, 4.5
Thermal Stress Testing
Método: IPC-TM-650 2.4.24.13
Condición: 288 Degree Celsius, Solder Dip
Resultado: No Delamination after 100S
Electrical Properties
Resistividad de volumen
After Moisture Resistance: IPC-TM-650 2.5.17.1, MΩ·cm, 5.0mi + 08
E-24/125: MΩ·cm, 5.0mi + 06
Resistividad superficial
After Moisture Resistance: IPC-TM-650 2.5.17.1, MΩ, 5.0mi + 07
E-24/125: MΩ, 5.0mi + 06
Resistencia al arco
Método: IPC-TM-650 2.5.1
Condición: D-48/50+D-4/23
Unidad: s
Typical Value: 126
Avería dieléctrica
Método: IPC-TM-650 2.5.6
Condición: D-48/50+D-4/23
Unidad: kV
Typical Value: 60
Dissipation Factors
Dissipation Constant (Dk)
1megahercio: IPC-TM-650 2.5.5.9, –, 4.7
CEI 61189-2-721: –, –
Factor de disipación (df)
1megahercio: IPC-TM-650 2.5.5.9, –, 0.016
CEI 61189-2-721: –, –
Mechanical Properties
Fuerza de pelado (1oz HTE Copper Foil)
Initial: IPC-TM-650 2.4.8, N/mm, –
After Thermal Stress: IPC-TM-650 2.4.8, N/mm, 1.8
En 125 Degree Celsius: N/mm, 1.6
Resistencia a la flexión
LW: IPC-TM-650 2.4.4, A, MPA, 550
CW: IPC-TM-650 2.4.4, A, MPA, 450
Other Properties
Water Absorption
Método: IPC-TM-650 2.6.2.1
Condición: E-1/105_D-24/23
Unidad: %
Typical Value: 0.10
Comparative Tracking Index (CTI)
Estándar: IEC60112
Clasificación: SOCIEDAD ANÓNIMA 0
Inflamabilidad
UL94: C-48/23/50, Rating V-0
E-24/125: Rating V-0
Remarks and Explanations
Specification Sheet: IPC-4101/21, for reference only.
Basis of Typical Values: Based on a 1.6mm specimen; Tg applicable for specimens ≥0.50mm.
Data Rights & Details: For detailed information, contact Shengyi Technology Co., Limitado. Reservados todos los derechos.
Conditions Explanation
do: Humidity conditioning
D: Immersion conditioning in distilled water
mi: Temperature conditioning
Digits Following Letters: First digit = preconditioning duration (horas), second digit = preconditioning temperature (°C), third digit = relative humidity.
