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TU-768 Digital de alta velocidad (HSD) Materiales de PCB

High-Tg and High Thermal Reliability Laminate and Prepreg

Centro: TU-768; Preparar: TU-768P

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) proceso. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

Main Applications

Características clave

Property

Typical Values Presupuesto
tg (DMA) 190°C
tg (DSC) 180°C
tg (TMA) 170°C
td (TGA) 340°C
CTE z-axis (50 a 260 °C) 2.7%
T-260/ T288 >60 min/ >15 mín.
Permittivity @1GHz(RC 50%) 4.3
Loss Tangent @1GHz(RC 50%) 0.018

Industry Approvals

Disponibilidad estándar

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