Materiales de PCB TUC TU-872 SLK y TU-87P SLK

Descripción general

TUC TU-872 SLK and TU-87P SLK are PCB materials with low Dk/Df and high thermal reliability. TU-872 SLK serves as the Core, while TU-87P SLK functions as the Prepreg (PÁGINAS).

Composición y propiedades

TU-872 SLK is crafted from high-performance modified epoxy resin FR-4. Reinforced with ordinary woven E glass, this PCB material is designed to exhibit a low dielectric constant and low loss factor, making it ideal for high-speed low-loss PCB and high-frequency multilayer PCB applications. It is compatible with environmentally friendly lead-free processes and FR-4 processes. TU-872 SLK multilayer PCB also demonstrates excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, Resistencia a la cafetería, and enhanced toughness due to compounds that form an allyl network.

Industry Approvals

TUC TU-872 SLK and TU-87P SLK have received industry approvals, including PC-4101E Type Designations /29, /99, /101, /126. They are IPC-4101E/126 Validation Services QPL Certified, with a UL Designation – ANSI Grade of FR-4.0. The UL File Number is E189572, and the Flammability Rating is 94V-0. The Maximum Operating Temperature is 130°C.

Disponibilidad estándar

TUC TU-872 SLK and TU-87P SLK are available in thicknesses ranging from 0.002” [0.05milímetros] a 0.062 " [1.58milímetros], en forma de hoja o panel. Copper Foil Cladding ranges from 1/3 a 5 oz for built-up and double-sided boards. Prepregs are available in roll or panel form, with Glass Styles including 106, 1080, 3313, 2116, and other prepreg grades available upon request.