6Carte PCB du module WiFi HDI L 2+N+2
PCB HDI (2+N+2) Caractéristiques
Enhanced Capabilities for BGAs
- Smaller Ball Pitch and Higher I/O Count: Suitable for BGAs with these specifications.
Increased Routing Density
- Complex Designs: Enhances routing density in intricate designs.
Capacité de feuille
- Sheet Handling: Offers robust sheet capability.
Qualité des matériaux
- Lower Dk/Df Material: Provides better signal transmission performance.
Vias remplis de cuivre
- Conductive Pathways: Utilizes copper filled vias for improved electrical conductivity.
Applications
Appareils mobiles
- Téléphones portables: Ideal for advanced smartphones.
- PDA: Suitable for personal digital assistants.
Computing Devices
- UMPCS: Perfect for ultra-mobile personal computers.
Gaming and Imaging
- Consoles de jeux portables: Enhances the performance of handheld gaming devices.
- Digital Cameras and Camcorders: Ideal for high-resolution imaging equipment.
