Composition des matériaux
The Aluminum Nitride Ceramic PCB is composed of high-quality ceramic materials, specifically ceramic PCB and ceramic substrate. This combination ensures exceptional thermal conductivity and electrical insulation properties.
Caractéristiques de performance
Le PCB features a 2-layer ceramic structure with a white color appearance. The thickness of the aluminum nitride layer is precisely 0.635mm, providing a sturdy base for composants. The copper thickness of 1OZ (35un) ensures good electrical conductivity, while the immersion gold surface treatment with a gold thickness of >=3U” enhances corrosion resistance and ensures smooth soldering processes.
Caractéristiques distinctives
- Conductivité thermique élevée: Aluminum nitride offers excellent thermal conductivity, making it suitable for high-power and high-frequency applications.
- Durabilité: Ceramic materials are known for their hardness and durability, contributing to the PCB’s long lifespan.
- Précision: The minimum aperture of 0.8mm allows for the placement of fine components, ensuring high-density packaging.
Processus de production
The production of Aluminum Nitride Ceramic PCBs involves several critical steps:
- Préparation des matériaux: High-quality aluminum nitride powder and other ceramic materials are mixed and pressed into the desired shape.
- Sintering: The pressed ceramic substrate undergoes sintering at high temperatures to achieve the required density and strength.
- Copper Deposition: A layer of copper is deposited on the ceramic substrate using advanced metallization techniques.
- Modèle de circuit: The copper layer is etched to form the desired circuit patterns.
- Hole Drilling: Through holes are drilled to allow for interconnections between layers.
- Ceramic Dam Technology: This unique technology ensures the precise alignment and sealing of holes, enhancing the PCB’s reliability.
- Traitement de surface: The PCB undergoes immersion gold plating to provide a corrosion-resistant surface finish.
Scénarios d'application
Aluminum Nitride Ceramic PCBs are ideal for various high-performance applications:
- High-Power Electronics: Suitable for use in power supplies, onduleurs, and other high-power electronic devices due to their excellent thermal management capabilities.
- Circuits haute fréquence: Perfect for RF and microwave circuits that require low loss and high stability.
- Équipement médical: Used in medical devices that demand precision, fiabilité, and high-performance electronics.
- Aérospatial et défense: Ideal for applications in harsh environments where durability and thermal resistance are crucial.
En résumé, Aluminum Nitride Ceramic PCBs offer a combination of exceptional thermal conductivity, durabilité, and precision, making them ideal for high-performance electronics across various industries.