UGPCB

High-Current Double-Sided Power PCB Manufacturer | FR4, 1oz+ Copper, Normes IPC | UGPCB

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Double-Sided Power PCBs: Fiable, High-Current Boards for Demanding Applications

In an era of high-power electronics, stable and efficient power management is critical. UN circuit imprimé (PCB) optimized for power transmission and conversion is often the cornerstone of system reliability. Our double-sided power PCBs are engineered to meet the stringent challenges of high current, voltage, et gestion thermique.

Double-sided FR4 power PCB with wide copper traces and multiple vias for high current capacity.

Présentation du produit: What is a Double-Sided Power PCB?

A double-sided power PCB is a specialized printed circuit board designed to carry and distribute high current and manage substantial power across its two layers. Unlike standard signal PCBs, its core design objectives are low impedance, high current-carrying capacity, and superior thermal performance. We use FR-4 (a flame-retardant glass-reinforced epoxy laminate) as the base material, ensuring every board performs reliably in applications like power converters, entraînements à moteur, and industrial power supplies through stringent process control.

Spécifications de base

  • Modèle: Double-Sided Power PCB

  • Matériau de base: High-Quality FR-4

  • Nombre de couches: 2 Calques

  • Épaisseur du panneau: 1.6mm (Standard, excellent mechanical strength)

  • Épaisseur du cuivre (Finished): 1once (35µm) - A key parameter for current carrying capacity. (2once, 3oz available)

  • Finition de surface: Lead-Free HASL (Nivellement de la soudure à air chaud). Provides excellent solderability and cost-effectiveness.

  • Min.. Trace / espace: 6mil (0.15mm), sufficient for most power layouts.

  • Solder Mask Color: Vert (Standard)

Design Essentials & Principe de fonctionnement

Key Design Considerations:

  1. Wide Traces & Cuivre lourd: Power paths (par ex., Vin, Vout, GND) use the widest possible traces with 1oz or thicker copper to minimize resistance, heat generation, and voltage drop.

  2. Adequate Via Stitching: Multiple vias in arrays are used to connect the same power net on both layers, significantly reducing parasitic resistance and inductance of the vias and enhancing current capacity.

  3. Gestion thermique: Strategic placement of heat-generating components (par ex., MOSFETs, inducteurs) alongside thermal vias et exposed copper pads to efficiently transfer heat to the opposite side or an external heatsink.

  4. Safety Spacing: Electrical clearance and creepage distances for high-voltage lines are strictly set according to safety standards (par ex., UL, IEC) to ensure operational safety.

Principe de fonctionnement:

The double-sided power PCB serves as a passive interconnection platform. Its function is to provide optimal electrical and physical connections for active power composants (ICS, transformateurs, condensateurs, inducteurs). Through meticulously designed high-power traces, it ensures energy is transferred from input to conversion circuitry and then to the load with minimal loss and heat generation. Effective thermal path design keeps component junction temperatures within safe limits, enabling reliable Assemblage PCBA and long-term stable operation.

Product Categories, Matériels & Caractéristiques structurelles

Common Applications/Categories:

  • DC-DC Converter PCBs

  • AC-DC Power Supply Module PCBs

  • Motor Driver PCBs

  • Inverter/VFD PCBs

  • High-Power LED Driver PCBs

  • Battery Management System (Bms) PCB

Materials Used:

  • Substrat: FR-4, offering excellent insulation, résistance mécanique, et le retard de la flamme (94V-0).

  • Conductive Layer: Electro-deposited copper foil (starting at 1oz, customizable to 2oz, 3once, and beyond).

  • Masque de soudure: Standard green LPI (Liquid Photo-Imageable) ink for protection.

  • Finition de surface: Standard Lead-Free HASL. Other finishes like ENIG or OSP are available upon request.

Caractéristiques structurelles:

  1. Dual-Side Layout: Components can be placed on both top and bottom layers, maximizing space for efficient power routing.

  2. Reinforced Power Planes: While not having dedicated power planes, large copper pours on both layers create highly effective “pseudo” power planes.

  3. Integrated Thermal Management: Features like thermal vias and large exposed copper areas facilitate heat dissipation to enclosures or heatsinks.

  4. Construction robuste: The standard 1.6mm board thickness provides superior mechanical rigidity, suitable for heavy components like large capacitors and heatsinks.

UGPCB Standard Production Flow & Performance Advantages

Our Manufacturing Process:

DFM Review → Material Prep → Drilling → Plating (PTH) → Pattern Transfer → Pattern Plating (Copper Build-up) → Etching → Solder Mask Application → Surface Finish (HASL) → Silkscreen → Electrical Testing → Final Inspection → Packaging & Expédition

We maintain strict control over every step, particularly copper plating thickness and etch uniformity, to ensure precision and current-carrying capability of power traces.

Key Performance Advantages:

  • High Current Capacity: Optimized copper weight and trace design for handling Ampere-level currents.

  • Low Thermal Resistance: Innovative cooling features effectively reduce hot spot temperatures, extending component lifespan.

  • High Stability: Rigorous process and material control ensure stable performance in harsh environments (high temp/humidity).

  • Strong Compatibility: Proven HASL surface finish offers excellent solderability for volume PCB production.

  • Rentable: Provides competitive pricing for both PCB quick-turn prototypes and volume production without comp

Large gamme d'applications

UGPCB’s double-sided power PCBs are the ideal choice for numerous high-power electronic devices:

  • Contrôle industriel: Variable Frequency Drives (VFDs), servo drives, PLC power modules.

  • Nouvelle énergie: PV inverters, Energy Storage System (Es) power conversion systems, charging pile modules.

  • Électronique automobile: On-Board Chargers (Obc), DC-DC converters, motor controllers.

  • Electronique grand public: High-wattage adapters, gaming console PSUs, high-end audio amplifiers.

  • Telecom Equipment: Base station power supplies, network equipment power distribution boards.

Why Choose UGPCB for Your Double-Sided Power PCBs?

We understand the complexities of power Conception de circuits imprimés. Choosing UGPCB means gaining more than just a circuit board; you gain a reliable power solution partner. We offer comprehensive support from PCB design review et quick-turn prototyping to volume production, ensuring your product’s smooth journey from concept to market.

Contact a UGPCB sales engineer today for a customized quote and technical solution for your double-sided power PCB needs! Let our expertise empower your product with stable, reliable performance.

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