eMMC PCB Package Substrate Product Overview
In today’s data-centric world, the performance and reliability of embedded storage are critical. EMMC (embedded MultiMediaCard) serves as the core storage unit in smartphones, comprimés, IoT devices, and other consumer electronics. UGPCB, leveraging deep expertise in Interconnexion à haute densité (IDH) Fabrication de PCB, offers specialized eMMC Package Substrate PCBs. Designed with HL832NS material in a 4-layer, ultra-thin configuration, this substrate is the essential platform for high-speed, stable electrical interconnection between the memory controller, NAND flash dies, et la carte principale. It is the optimal solution for developing next-generation compact, high-capacity storage modules.
What is an eMMC Package Substrate PCB?
An eMMC Package Substrate PCB is a specialized, miniaturized circuit imprimé used internally within an eMMC chip package. It serves as the core interposer, providing the electrical connections and physical support between the storage controller silicon die, the NAND flash memory dies, and the external Ball Grid Array (BGA) interface. Its design and manufacturing quality directly determine the signal integrity, thermal performance, and overall reliability of the final eMMC module.
Faits saillants de conception & Key Technical Specifications
To meet the stringent demands of eMMC chips for high bandwidth and miniaturization, UGPCB’s eMMC substrate focuses on these critical design parameters:
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High-Density Routing: Supports ultra-fine circuitry with minimum line width/space of 20µm.
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Micro-Via Capability: Caractéristiques minimum via diameter of 0.1mm for high-density I/O fanout.
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Stable Lamination: 4-layer construction with a controlled total thickness of 0.21mm, balancing electrical performance and mechanical strength.
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High-Reliability Surface Finish: Or doux (ACCEPTER) plating provides an oxidation-resistant, low-resistance surface for reliable wire bonding or flip-chip attachment.
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Precise Solder Mask: PSR-4000 AUS308 solder mask offers excellent insulation and chemical resistance.
How It Works & Caractéristiques structurelles
How It Works: The substrate acts as the internal “nervous system” and “power grid” of the eMMC module. Its conductive traces and micro-vias route command signals from the controller to the NAND flash dies and return data. Dedicated power and ground planes ensure stable, low-noise power delivery.
Caractéristiques structurelles:
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Ultra-Thin & Compact: 0.21mm final thickness et 11.5mm x 13mm unit size minimize space consumption.
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Advanced Core Material: Built on HL832NS, a high-performance laminate known for excellent thermal stability and low signal loss (DK / DF bas), crucial for heat dissipation.
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Multi-Layer Architecture: Le 4-layer stack-up (typically signal, pouvoir, sol) optimizes signal paths, reduces crosstalk, and controls impedance.
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BGA Pad Array: The bottom side features a precise BGA pad layout for reliable surface-mount technology (CMS) assembly of the entire module onto the host motherboard.
Primary Application & Cas d'utilisation
Primary Application: Core interconnection platform within EMMC 5.1 and above chip packages.
Applications typiques (Cas d'utilisation):
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Smartphones & Comprimés: Primary internal storage.
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Smart TVs & Set-Top Boxes: System storage and caching.
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Appareils IoT: Smartwatches, smart home hubs requiring compact embedded storage.
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Industrial Control Systems: Embedded devices demanding high data reliability.
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Automotive Infotainment: Storage modules meeting automotive-grade stability requirements.
Classification & Composition des matériaux
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Classification: Can be categorized by application grade: Consumer, Industriel, and Automotive (this model is tailored for consumer & high-end industrial applications).
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Material Stack-Up:
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Core Laminate: HL832NS Haute-Tg, Low-Loss material.
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Couches conductrices: High-purity electrolytic copper foil.
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Masque de soudure: PSR-4000 AUS308 (Vert, matte/gloss optional).
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Finition de surface: Or par immersion au nickel autocatalytique (ENIG – Soft Gold).
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Performance Advantages & Caractéristiques clés
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Intégrité supérieure du signal: Controlled impedance and low-loss HL832NS material ensure stable high-speed data transfer.
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Haute fiabilité: Stringent process controls and material selection guarantee long-term durability.
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Effective Thermal Management: The laminate’s good thermal conductivity aids in heat dissipation from the active dies.
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Tight Manufacturing Tolerances: 20µm line/space and 0.1mm micro-vias demonstrate advanced PCB HDI fabrication expertise.
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End-to-End Solution: UGPCB provides collaborative support from substrate design review et Fabrication de circuits imprimés à rapid PCBA prototyping.
Production Process Overview
Our eMMC Package Substrate manufacturing follows a stringent HDI PCB process flow:
Material Prep → Inner Layer Imaging → Lamination → Laser Drilling (0.1mm vias) → Via Metallization → Outer Layer Imaging (20µm lines) → Solder Mask Application (PSR-4000) → Surface Finishing (Or doux) → Electrical Testing → Routing/Scoring → Final Inspection & Conditionnement.
Why Choose UGPCB for Your eMMC Package Substrate?
Choosing UGPCB means partnering with an expert in memory chip substrate manufacturing. We understand the technical evolution of storage interfaces and offer full-chain support to ensure your product excels in performance, coût, et fiabilité.
Contact us today to discuss your eMMC Package Substrate requirements and request a quotation. Let UGPCB’s precision engineering be the reliable foundation for your next-generation storage solutions.