ITEQ IT-158 PCB Laminate: Comprehensive Analysis of Properties, Applications & Selection Guide

Key Performance Parameters & Avantages techniques

ITEQ IT-158 laminate emerges as a premier choice for high-end PCB manufacturing through exceptional technical specifications:

Thermal Reliability

• Tg: 155° C (ensures structural stability during lead-free soldering)

• T-288: >30 seconds at 288°C (superior thermal shock resistance)

• Td-5%: 345° C (prevents delamination in extreme conditions)

Mechanical Stability

• Z-axis CTE: 40ppm/°C (3.3% expansion from 50-260°C)

• Résistance à l'écoulement: ≥8lb/inch (copper-clad bond integrity)

• Absorption d'eau: 0.08% (maintains electrical stability in 85% RH environments)

High-Frequency Signal Transmission Characteristics

Dielectric Performance at 10GHz

• Ne sait pas: 4.0 ±0.05

• Df: 0.018
  *(Ideal for 5G/mmWave applications with 0.15dB/inch insertion loss reduction)*

Scénarios d'application typiques

5G Communication Infrastructure

• Base station antennas

• Optical transceivers

Électronique automobile

• ADAS radar systems (AEC-Q200 compatible)

• ECU control modules

Automatisation industrielle

• Servo drives (10,000hr MTBF at 105°C)

• Power inverters

Electronique grand public

• Smartphone RF modules

• Laptop motherboard HDI designs

PCB Material Selection Workflow

Phase 1: Requirement Analysis

• Operating temperature range: Tmax +20°C margin

• Signal frequency threshold: ≥1GHz critical

• Environmental rating: IP67 compliance

Phase 2: Comparative Evaluation

Phase 3: Reliability Validation

1. PCT Test: 121°C/100%RH/2atm ×96hr

2. Thermal Stress: 3× solder dips @288°C

3. CAF Resistance: IPC-TM-650 2.6.25 conforme

Design Optimization Strategies

Stackup Configuration

• Hybrid dielectric construction (≤5% thickness tolerance)

• Buried vias for thermal management

Contrôle de l'impédance

• Microstrip line tolerance: ± 10%

• Differential pair spacing: 3× dielectric height

Processus de fabrication

• Forage: Back-drilling with ≤0.15mm stub

• Finition de surface: ENEPIG preferred (Ni:3-5µm, Au:0.05-0.1µm)