1.0UGPCBhttps://www.ugpcb.comSMT BGA Design and Assembly Process: BGA Defects and Failure Analysis Cases - UGPCBrich600338<blockquote class="wp-embedded-content" data-secret="WMQalHDfko"><a href="https://www.ugpcb.com/news/pcb-tech/bga-defect-and-failure-analysis/">SMT BGA Design and Assembly Process: BGA Defects and Failure Analysis Cases</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://www.ugpcb.com/news/pcb-tech/bga-defect-and-failure-analysis/embed/#?secret=WMQalHDfko" width="600" height="338" title="“SMT BGA Design and Assembly Process: BGA Defects and Failure Analysis Cases” — UGPCB" data-secret="WMQalHDfko" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script>
/*! This file is auto-generated */
!function(d,l){"use strict";l.querySelector&&d.addEventListener&&"undefined"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!/[^a-zA-Z0-9]/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret="'+t.secret+'"]'),o=l.querySelectorAll('blockquote[data-secret="'+t.secret+'"]'),c=new RegExp("^https?:$","i"),i=0;i<o.length;i++)o[i].style.display="none";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute("style"),"height"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):"link"===t.message&&(r=new URL(s.getAttribute("src")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener("message",d.wp.receiveEmbedMessage,!1),l.addEventListener("DOMContentLoaded",function(){for(var e,t,s=l.querySelectorAll("iframe.wp-embedded-content"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute("data-secret"))||(t=Math.random().toString(36).substring(2,12),e.src+="#?secret="+t,e.setAttribute("data-secret",t)),e.contentWindow.postMessage({message:"ready",secret:t},"*")},!1)))}(window,document);
//# sourceURL=https://www.ugpcb.com/wp-includes/js/wp-embed.min.js
</script>
https://www.ugpcb.com/wp-content/uploads/2024/11/6cb4f21c-0284-4dc0-9bdc-f31cdc16fe7e-scaled.webp25601778This article identifies possible assembly anomalies related to the assembly of BGA components. It describes post-process failures related to the characteristics of the mounting structure as well as variations in solder balls used as BGA terminals. In many cases, if the features are attributed to connection point failures, a special discussion on the metallography of the connectors is required. The final connection point structure is also analyzed.