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</html><thumbnail_url>https://www.ugpcb.com/wp-content/uploads/2024/09/2353b8a0-536e-4116-9183-d9ec05bf2bf3-scaled.jpg</thumbnail_url><thumbnail_width>2560</thumbnail_width><thumbnail_height>1626</thumbnail_height><description>Product name:&#xA0;&#xA0;communication backplane pcb  Material: isola 370hr  Df (dissipation factor): 0.021  Dk (dielectric constant): 4.04  Glass transition temperature: TG180&#x2103;  Td: 340&#x2103;  Number of Layers: 14 layers  Board thickness: 2.4mm  Surface technology: Immersion gold  Copper thickness: 1OZ  Minimum line width/line spacing: 6mil/6mil</description></oembed>
