Structure and Composition
Base Plate and Layers
The high-frequency hybrid PCB splint includes a base plate, che è piegato e posizionato sul primo strato di filo interno, il primo strato di filo esterno, and the top surface of the solder mask ink layer from bottom to top in order. The positioning circuit layer, the second outer wire layer, and the bottom surface of the substrate are also part of this structure.
High-Frequency and Auxiliary Areas
The substrate includes a high-frequency area and an auxiliary area. The auxiliary area is fixed, while the inlay in the high-frequency area should be located at a fixed position.
Design and Features
Division of Areas
Il modello di utilità fornisce una stecca ibrida ad alta frequenza, che è diviso in due parti: un'area ad alta frequenza e un'area ausiliaria. This design provides mechanical support.
High-Frequency Materials
The high-frequency area is independently arranged, and only this area is made of high-frequency materials. This minimizes the use of high-frequency board materials while satisfying high-frequency signals, thereby reducing production costs.
Product Specifications
Classification and Layers
- High Frequency Hybrid Product Classification Layers: 6 Strati
Materials and Dimensions
- Used Board: RO4350B + FR4
- Spessore: 1.6mm
- Misurare: 210mm * 280mm
Surface Treatment and Applications
- Trattamento superficiale: Gold-plated
- Apertura minima: 0.25mm
- Applicazione: Comunicazione
- Caratteristiche: High Frequency Mixed Pressure