UGPCB

12-Layer Gold Finger PCB Manufacturer | 1.6mm FR-4 TG170 ENIG & Hard Gold Plating | UGPCB

Ultimin

High-Performance 12-Layer ENIG + PCB con dito d'oro Panoramica del prodotto

IL 12-Layer Gold Finger PCB is a hallmark product in the high-end circuito stampato industria, engineered specifically for electronic equipment demanding extreme reliability, stable electrical connections, and frequent plugging/unplugging cycles. UGPCB employs advanced manufacturing processes and premium materials (FR-4 TG170), combining 2μ” Electroless Nickel Immersion Gold (Essere d'accordo) surface finish with 30μ” Hard Gold Finger Plating tecnologia. We deliver a comprehensive high-reliability PCB solution for applications ranging from industrial controls to advanced communication systems.

High-Performance 12-Layer ENIG + PCB con dito d'oro

Definizione del prodotto

A Gold Finger PCB refers to a circuit board featuring a series of exposed, rectangular contact pads plated with thick gold (“fingers”) along one edge. These boards are designed for direct insertion into a matching connector slot, establishing a stable, pluggable connection for electrical signals and power between devices. Questo prodotto è un 12-layer multilayer PCB with a standard thickness of 1.60mm, offering an optimal balance between complex circuit integration and mechanical robustness.

Considerazioni critiche sulla progettazione

  1. Gold Finger Area Design:

    • Chamfer (Bevel) Edge (Typically 20-45°): Facilitates smooth insertion into the connector—a critical aspect of Dito d'oro Progettazione di circuiti stampati.

    • Lead-in (Trace Fanout): Connections from the gold fingers to internal traces must have smooth curves, avoiding right angles to prevent stress concentration and plating cracks.

    • Solder Mask Clearance (Solder Mask Define): The gold finger area requires precise solder mask opening to ensure a clean, exposed plating surface.

  2. Controllo dell'impedenza & Integrità del segnale: As a 12-layer precision PCB, strict impedance control (per esempio., 50Ω single-ended, 100Ω differential) for high-speed signal layers is essential. Stack-up design must be optimized via simulation to minimize crosstalk.

  3. Thermal & Reliability Management: High-Tg material, coupled with a well-designed via structure, ensures the high-layer-count PCB operates stably in elevated temperature environments. Drovini placcati (PTHS) should be avoided at the root of gold fingers to prevent fluid entrapment and structural weakness.

Come funziona & Struttura

This PCB facilitates complex circuit interconnections through its internal 12 conductive layers. The core functionality resides in the Hard Gold Plated Fingers. The durable 30-microinch gold plating provides excellent conductivity, oxidation resistance, e resistenza all'usura. When the board is inserted into a backplane or card-edge connector, the gold fingers make tight, low-resistance electrical contact with the connector’s spring contacts, transmitting signals and power. The board core uses FR-4 TG170, providing solid mechanical support and electrical insulation.

Materiali core & Specifiche

Caratteristiche chiave & Vantaggi

  1. Unmatched Reliability: FR-4 TG170 high-Tg material E 12-layer precision lamination ensure long-term stability in harsh operating conditions.

  2. Extended Mating Cycle Life: 30μ” thick hard gold fingers far exceed standard plating thickness, offering exceptional wear resistance—the ideal choice for high-durability plug-in PCBs.

  3. Ottima integrità del segnale: The multilayer design provides uninterrupted reference planes for high-speed signals, and controlled impedance guarantees signal quality.

  4. Robust Thermal & Mechanical Performance: The 1.60mm standard thickness combined with high-Tg material delivers superior rigidity, gestione termica, and dimensional stability.

  5. Comprehensive High-End Solution: Da multistrato Fabbricazione di PCB A specialty surface finishing (Essere d'accordo + Selective Gold), UGPCB provides full-process control, ensuring consistent, risultati di alta qualità.

Manufacturing Process Flow

Panelization → Inner Layer Imaging → Lamination (12-Strato) → Drilling → Desmear & Electroless Copper Deposition → Outer Layer Imaging → Pattern Plating (for Hard Gold Fingers) → Etching → Solder Mask Application → ENIG Surface Finish → Gold Finger Beveling → Electrical Test (Sonda volante / Fixture) → Ispezione ottica automatizzata finale (AOI) → Imballaggio.

Applicazioni primarie & Casi d'uso

This product is the core component of high-end electronic devices requiring direct board-to-board plug connections O integration into backplane systems.

Scientific Product Classification

  1. Per conteggio strati: High-Layer-Count / Multilayer Circuit Board (≥8 layers, specificamente 12 strati).

  2. By Special Feature/Process: Dito d'oro (Gold Edge Connector) PCB, Mixed Surface Finish PCB (Essere d'accordo + Selective Hard Gold).

  3. By Material Property: Alta Tg (TG170) PCB, FR-4 Series PCB.

  4. By Application Grade: Industrial-Grade PCB, Telecom-Grade PCB, High-Reliability PCB.

Why Choose UGPCB’s 12-Layer Gold Finger PCB?

We understand that a reliable Gold Finger PCB is the foundation of your high-end equipment’s stable operation. Leveraging deep expertise in multistrato Produzione di PCB E specialty surface finish processes, UGPCB guarantees that every board delivered meets military-grade reliability standards with commercial-grade delivery efficiency. We provide not just a product, but a customized PCB solution.

Contact our technical sales team today to discuss your project requirements, receive a detailed quote, and qualify for a free design-for-manufacturability (DFM) review and sample program. Partner with UGPCB for your most demanding 12 layer circuit board applicazioni.

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