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F4T-1/2 Insulative teflon woven glass fabric copper-clad laminates

F4T-1/2: A High-Performance Circuit Baseplate for Microwave PCBs

F4T-1/2 is a specialized circuit baseplate constructed from insulative Teflon PCB, featuring electrolytic copper foil on both sides. The material undergoes high-temperature and high-pressure treatment to ensure optimal performance. This product boasts superior electrical properties, such as low dielectric constant and minimal loss, coupled with excellent mechanical strength, making it an ideal choice for Microwave PCB applications.

Specifiche tecniche

Aspetto

Dimensioni (mm)

Spessore e tolleranza

Proprietà meccaniche

Proprietà chimiche

Proprietà elettriche

Nome Test Conditions Unità Specification
Gravity Stato normale g/cm³ 2.2–2.3
Water absorption rate Dip in distilled water at 20±2°C for 24h % ≤0.01
Operating temperature High-low temp chamber ° C. -100~+150
Thermal conductivity coefficient Kcal/m.h.°C 0.4
Coefficient of thermal expansion Temp rise 96°C/hr *1 9.8–10*10^-5
Shrinkage factor 2 hours boiling water % 0.0005
Surface insulation resistance 500In DC, normal state ≥1*10⁷
Umidità e temperatura costanti ≥1*10⁵
Volume resistance Stato normale Mω.cm ≥1*10¹⁰
Umidità e temperatura costanti Mω.cm ≥1*10⁷
Pin resistance 500In DC, normal state ≥1*10⁵
Umidità e temperatura costanti ≥1*10⁵
Resistenza dielettrica superficiale Stato normale δ=1mm(kV/mm) ≥1.5
Umidità e temperatura costanti δ=1mm(kV/mm) ≥1.4
Permittivity 10GHz εr 2.2(± 2%)
Dielectric loss angle tangent 10GHz Tgside ≤1*10^-3

This comprehensive overview highlights F4T-1/2’s technical prowess, ensuring it meets stringent industry standards for microwave PCB baseplates.

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