Teflon Woven Glass Fabric Copper-Clad Laminates
Teflon woven glass fabric copper-clad laminates are formulated with varnished glass cloth, prepreg, and Teflon PCB resin through scientific formulation and strict technology procedures. These materials offer several advantages over the F4B series in terms of electrical performance, including a wider range of dielectric constants, low dielectric loss angle tangent, increased resistance, and more stable performance.
Specifiche tecniche
Aspetto
The appearance meets the specification requirements for microwave PCB baseplates specified in National and Military Standards.
Tipi
- F4BM220
- F4BM255
- F4BM265
- F4BM300
- F4BM350
Permittivity
- 2.20
- 2.55
- 2.65
- 3.0
- 3.50
Dimensioni (mm)
- 300*250
- 350*380
- 440*550
- 500*500
- 460*610
- 600*500
- 840*840
- 840*1200
- 1500*1000
For special dimensions, customized lamination is available.
Spessore e tolleranza (mm)
| Plate Thickness | Tolleranza |
|---|---|
| 0.25 | ±0.02～±0.04 |
| 0.5 | |
| 0.8 | |
| 1.0 | |
| 1.5 | ±0.05～±0.07 |
| 2.0 | |
| 3.0 | |
| 4.0 | |
| 5.0 |
Plate thickness includes the copper thickness. For special dimensions, customized lamination is available.
Proprietà meccaniche
Angularity
| Plate Thickness(mm) | Maximum Angularity mm/mm |
|---|---|
| Original board | Single-sided board |
| 0.25～ 0,5 | 0.03 |
| 0.8～ 1.0 | 0.025 |
| 1.5～ 2.0 | 0.020 |
| 3.0～ 5.0 | 0.015 |
Cutting/ Punching Property
- For plates <1mm, no burrs after cutting, minimum space between two punching holes is 0.55mm, no separation.
- For plates ≥1mm, no burrs after cutting, minimum space between two punching holes is 1.10mm, no separation.
Forza della pelatura
- In normal state: ≥18N/cm; no bubbling, no separation, and peel strength ≥15 N/cm when in the environment of constant humidity and temperature and kept in the melting solder of 260 degree Celsius±2 degree Celsius for 20 secondi.
Proprietà chimiche
According to different properties of baseplates, the chemical etching method for PCB can be used for the circuit processing, the dielectric properties of materials are not changed and the holes can be metallized.
Proprietà elettriche
| Names | Test Conditions | Unità | Specifications |
|---|---|---|---|
| Gravity | Stato normale | g/cm3 | 2.2～ 2.3 |
| Water absorption rate | Dip in distilled water of 20±2 degree Celsius for 24 ore | % | ≤0.02 |
| Operating temperature | Camera di temperatura ad alta bassa | gradi Celsius | -50～+260 |
| Thermal conductivity coefficient | Kcal /m .h. gradi Celsius | 0.8 | |
| Coefficient of thermal expansion | Temperature rise of 96 degree Celsius per hour | Coefficient of thermal expansion*1 | ≤5*10^-5 |
| Shrinkage factor | Two hours in boiling water | % | 0.0002 |
| Surface insulation resistance | 500In DC | Stato normale | Mω |
| Umidità e temperatura costanti | ≥1*10^3 | ||
| Volume resistance | Stato normale | Mω.cm | ≥1*10^6 |
| Umidità e temperatura costanti | ≥1*10^5 | ||
| Pin resistance | 500In DC | Stato normale | Mω |
| Umidità e temperatura costanti | ≥1*10^3 | ||
| Surface dielectric strength | Stato normale | δ=1mm(kV/mm) | ≥1.2 |
| Umidità e temperatura costanti | ≥1.1 | ||
| Permittivity | 10GHz | È | 2.20 |
| 2.55 | |||
| 2.65(± 2%) | |||
| 3.0 | |||
| 3.5 | |||
| Dielectric loss angle tangent | 10GHz | Tgside | ≤7*10^-4 |
UGPCB has produced Teflon woven glass fabric copper-clad laminates products steadily. If you need them, si prega di contattare UGPCB.