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TU-768 Digital ad alta velocità (HSD) Materiali PCB

High-Tg and High Thermal Reliability Laminate and Prepreg

Core: TU-768; Pre -preg: TU-768P

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) processo. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

Main Applications

Caratteristiche chiave

Proprietà

Typical Values Specifications
Tg (DMA) 190° C.
Tg (DSC) 180° C.
Tg (TMA) 170° C.
Td (TGA) 340° C.
CTE z-axis (50 A 260 ° C.) 2.7%
T-260/ T288 >60 min/ >15 min
Permittivity @1GHz(RC 50%) 4.3
Loss Tangent @1GHz(RC 50%) 0.018

Industry Approvals

Standard Availability

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