HDI製造プロセス機能

UGPCB: Pioneering High-Density Interconnect Innovation with Advanced HDI PCB Technology

Industry-Leading HDI PCB Manufacturing Capabilities

UGPCB stands at the forefront of HDI (高密度相互接続) PCB technology, driving progress in an era where electronic devices demand unprecedented thinness and functionality. Specializing in 4-40 layer multilayer boards with thickness ranging from 0.4mm to 6.0mm, we cater to diverse needs from consumer electronics to premium communication equipment.

Our cutting-edge Any-layer HDI technology enables seamless interconnection across over 10 プリント基板 レイヤー, delivering robust connectivity solutions for high-performance computing and communication devices. This capability positions us as a trusted partner for next-generation electronic applications.

Process Technology: Precision Meets Reliability

Advanced Equipment & 革新

UGPCB sets industry benchmarks in HDI PCB manufacturing through state-of-the-art equipment and process innovation:

• レーザー穴あけ加工: Achieves microvia processing as small as 0.075mm (3ミル) with precision exceeding industry standards
• Microviaテクノロジー: Hidden interconnections through next-layer vias eliminate fan-in/fan-out routing, significantly enhancing circuit density
• インピーダンス制御: Maintains +/-7% impedance tolerance for superior signal integrity in 5G and high-performance computing applications

Comprehensive Manufacturing Process

Our HDI production workflow integrates:

1. レーザー穴あけ加工: CO₂ laser systems ensure consistent hole quality and cleanliness
2. Plating Process: 12-18μm copper thickness guarantees electrical reliability
3. Pattern Transfer: Supports 1.5/1.5mil minimum line width/spacing for ultra-dense routing
4. Lamination Technology: Layer alignment accuracy within ±200μm ensures structural stability

We utilize high-performance PCB substrates including high-Tg FR-4 (140/150/170℃) and polyimide materials to ensure stable performance in high-temperature environments.

品質保証 & Testing Systems

Multi-Layered Inspection Protocols

UGPCB implements rigorous quality control through:

• あおい (自動光学検査)
• Flying Probe Testing
• X-ray Inspection

Microvia Reliability

The inherent reliability of our microvia technology stems from:

• Thinner construction with 1:1 アスペクト比
• Superior signal transmission stability compared to traditional through-holes
• Enhanced long-term durability for demanding applications

アプリケーション: Empowering Cutting-Edge Technologies

UGPCB’s HDI PCBs power high-tech applications across multiple sectors:

• 5G Communication: High-frequency PCBs for 5G base stations and RF modules
• カーエレクトロニクス: Stable signal transmission for navigation and entertainment systems
• 医療機器: Precision data acquisition for patient monitors and surgical instruments
• 産業管理: Efficient data exchange for PLCs and sensor networks

技術的な利点: UGPCBを選択する理由?

Superior Performance Features

1. スペース効率: Microvia/blind via designs reduce PCB footprint by up to 30%
2. 信号の完全性: Low-DK materials minimize signal delay and crosstalk for high-speed transmission
3. Design Flexibility: Enables complex circuits in compact spaces
4. 熱管理: Dedicated thermal layers improve heat dissipation for high-power applications

R&D Direction & 今後の展望

Next-Gen Technology Investment

UGPCB actively develops HDI PCBs with:

• Higher density and finer lines
• Lower signal loss characteristics
• Laser drilling advancements
• Nanomaterial integration
• Smart manufacturing systems

Our R&D team focuses on advanced microvia technologies and material innovations to support client roadmaps for 5G, ai, and IoT devices.

結論: Your Trusted HDI PCB Partner

業界のリーダーシップ

As an HDI PCB technology leader, UGPCB delivers:

• Advanced process capabilities
• Stringent quality control
• Continuous technological innovation

Comprehensive Solutions

From smartphones to automotive systems, we provide total high-density interconnect solutions. Choosing UGPCB means selecting:

• Superior performance
• Reliable quality
• Technological foresight

Contact UGPCB today to explore how our HDI PCB technology can empower your next-generation products.