Applications Overview
- Preamplifiers
- Satellite Antennas
- GPS Tracking Devices
- SAN Storage
- AC Drives
- GSM Signal Boosters
- Mobile Broadband Routers
- 220V Inverters
- Memory Modules
- Car Dashboards
10-Layer Manufacturing Process
材料の準備
- Cut material to size/bake material
Drilling and Inner Layer Patterning
- Inner layer drilling
- Inner layer pattern transfer
- Inner layer circuit inspection
- Etch/stripping
- Etch inspection
Surface Preparation and Laminating
- Browning
- Prepreg preparation
- Layers Pressing
- Cutting copper foil
- Positioning
- ラミネート加工
Drilling and Hole Preparation
- Target hole
- 掘削
- Desmear removal
- 浸漬銅
Circuit Formation
- Image and text transfer
- Circuit inspection
- Copper and tin plating
- Film removal Etching
- Tin removal
- Etching inspection
Quality Control Tests
- Dielectric inspection test
- Solder mask inspection
Final Assembly and Finishing
- 文章
- Baking pan
- Spray tin, イマージョンゴールド, Immersion tin
- 形
- V cut
Final Product Inspection and Packaging
- Finished Product Test
- Antioxidant
- 最終検査
- Finished Product Extraction
- 包装