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16-layer 2+N+2 high-precision PCB design - UGPCB

HDI PCB 設計/

16-layer 2+N+2 high-precision PCB design

名前: 16-layer two-stage high-precision PCB design

皿: TG170 /TG180, F4BM, FR4, FR1-4, 等.

Designable layers: 1-32 レイヤー

最小ライン幅とライン間隔: 3ミル

最小レーザーアパーチャ: 4ミル

最小機械的開口: 8ミル

銅箔の厚さ: 18-175cm (標準: 18CM35CM70cm)

皮の強度: 1.25N/mm

最小パンチングホールの直径: 片側: 0.9mm/35mil

最小穴の直径: 0.25mm/10mil

開口耐性: ≤φ0.8mm±0.05mm

穴の耐性: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

  • 製品詳細

Overview of 16-Layer Stack PCB

A 16-layer stack has 16 layers of routing and is typically used for high-density designs.

Routing Challenges and Solutions

Routing Challenges

In EDA applications, routing techniques often fail to route the design.

解決: Adding Multiple Layers

That’s why manufacturers add multiple layers to accommodate the complexity of high-density designs.

Specifications of 16-Layer PCB Fabrication

Composition

  • Made of 16 レイヤー
  • Made of halogen-free materials, アルミニウム, CEM, and FR

Plate Thickness

  • Extended to 7 mm

Board Size

  • Maximum finished board size is 500 x 500 mm

Finishes

  • Halogen-free gold and silver plated

UGPCB: High-Quality Fabrication

UGPCB offers high-quality fabrication of 16-layer stack PCBs, ensuring reliability and performance for high-density designs.

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