UGPCB 18 層サーバー PCB ソリューション | データセンター向けハイパフォーマンスコンピューティングPCB

UGPCB 18-Layer Server PCB: Engineered for High-Performance Computing & データセンター

In the era of data centers and cloud computing, server stability and performance are critical to digital business operations. As the fundamental hardware carrier, the precision design and exceptional quality of Server プリント基板 (プリント基板) are paramount. Leveraging deep industry expertise and cutting-edge technology, UGPCB provides high-performance, highly reliable 18-layer server PCBs to meet the most demanding requirements of next-generation data center applications.

製品の概要 & 意味

A server PCB is the core component of server motherboards, storage backplanes, and various functional daughter cards. It hosts critical components like CPUs, メモリ, and chipsets, facilitating high-speed signal transmission, 配電, and system interconnection. Designed specifically for high-performance application servers, this UGPCB product utilizes an 18-layer high multilayer structure and an enhanced board thickness of 2.4mm ±10%, serving as a robust hardware foundation for processing massive datasets and supporting high-speed computations.

Core Design Highlights & Technical Analysis

To address server platforms’ extreme demands for signal integrity, パワーの完全性, および熱管理, this product integrates several key technologies:

1. Advanced Stack-up & 材料:

   • ラミネート: Utilizes ITEQ IT968G high-speed, low-loss material. Its high Tg (ガラス転移温度) ensures dimensional stability and consistent electrical performance under prolonged high-temperature server operation, effectively reducing signal transmission loss.

   • レイヤー & 銅の重量: An 18-layer complex stack-up with a meticulously designed hybrid copper weight scheme (featuring 2Oz thick copper foil on select inner layers). This optimizes the current-carrying capacity and thermal performance of power planes while enabling fine-line routing on high-speed signal layers.

2. Precision Routing & Interconnection:

   • Line Capability: Achieves ultra-fine line width/space of 0.1mm/0.1mm, meeting the fan-out and interconnection requirements for high-density BGA packages (例えば。, CPU, GPU, FPGA).

   • Microviaテクノロジー: Supports a minimum mechanical drill diameter of 0.20mm, enhancing routing density and space utilization.

3. Key Technologies for Signal Integrity:

   • バックドリリング: For high-speed differential signals (例えば。, PCIE, SAS, イーサネット), the back-drilling process removes unused copper stubs from through-holes, significantly reducing signal reflection and attenuation. This is a core process for ensuring signal quality in 高速PCB.

   • RTF Copper Foil: Uses Reverse Treated Foil, which provides a smoother copper surface. This effectively reduces skin effect loss for high-frequency signals, improving signal transmission efficiency.

4. Reliable Surface Finish:

   • エレクトロレスニッケルイマージョンゴールド (同意する) is applied as the final surface treatment. ENIG provides a flat surface, excellent solderability, a reliable contact interface, and long-term oxidation resistance, making it ideal for soldering dense, fine-pitch コンポーネント on server PCBs.

製品の特徴 & 利点

• Exceptional Electrical Performance: High-speed IT968G laminate combined with back-drilling and RTF foil ensures low-loss, low-latency transmission of high-frequency signals, making it an ideal choice for 高周波プリント基板 そして 高速PCB.

• Superior Power Handling & 熱管理: 2Oz inner-layer copper and the 2.4mm board design enhance current-carrying capacity, overall structural rigidity, and thermal conductivity.

• 高密度 & 信頼性: The 18-layer routing space coupled with 0.1/0.1mm line width/space supports the most complex designs. Strict process control and high-Tg materials ensure long-term reliability for 24/7 uninterrupted operation.

• End-to-End Service Support: UGPCB offers not only top-tier プリント基板の製造 but also a one-stop solution from design review to production, accelerating your time-to-market.

製造工程の概要

Our manufacturing adheres to stringent IPC標準 and a quality management system:
Engineering Review → Material Preparation → Inner Layer Imaging → Lamination → Drilling & Back-Drilling → Hole Metallization → Outer Layer Imaging → Plating (for hybrid copper weight) → Solder Mask Application (Pre-ENIG) → ENIG → Routing / Profiling → Electrical Test & 最終検査

https://via.placeholder.com/800×450.png?text=18-Layer+PCB+Cross-Section
Alt Text: Cross-sectional view of an 18-layer server PCB board, detailing precise lamination and back-drilled via structures for high-speed signal transmission.

アプリケーション & 分類

This high-performance PCB is widely used in:

• Enterprise & Cloud Server Motherboards

• Data Center AI Computing Acceleration Cards

• High-Performance Storage Servers & バックプレーン

• Network Switch & Communication Equipment Core Boards

Technical Classification:

• レイヤーカウントごとに: 高い 多層プリント基板 (18 レイヤー)

• テクノロジーによって: High-Speed/High-Frequency PCB, Back-Drilled PCB, 重い銅の PCB

• アプリケーションによって: Server/Data Center PCB

• By Surface Finish: 同意する (エレクトロレスニッケルイマージョンゴールド) プリント基板

UGPCBを選択します, and you select more than just a high-quality server PCB board; you gain a trusted partner in advanced PCB manufacturing. We are dedicated to translating complex technical details into reliable advantages for your products, empowering your next-generation data center solutions.

Contact our expert team today for a customized PCB solution quote and technical consultation!