Introduction to the 4L 1+N+1 HDI Wifi Module Product Overview
The 4L 1+N+1 HDI Wifi Module is a cutting-edge electronic module designed for high-density interconnect applications. This module utilizes advanced technology to ensure reliable and efficient performance in various electronic devices.
意味
A High-Density Interconnect (HDI) module refers to a プリント基板 (プリント基板) that features higher wiring density than traditional PCBs, enabling more compact and complex designs. The “4L 1+N+1” designation indicates a four-layer structure with specific layer configurations.
設計要件
The 4L 1+N+1 HDI Wifi Module is meticulously designed to meet stringent requirements:
- レイヤー: Four layers with a specific stack-up of 1+N+1.
- 材料: Made from high-quality FR-4材.
- 厚さ: The overall finished thickness of the module is 1.0mm.
- 銅の厚さ: Features inner copper layers at 1OZ and outer layers at 0.5OZ.
- 表面処理: Incorporates immersion gold and Organic Solderability Preservatives (OSP) for enhanced durability and solderability.
- 最小トレース/スペース: Supports minimal trace and space widths of 4mil.
- ミンホール: Accommodates mechanical holes as small as 0.2mm and laser holes as fine as 0.1mm.
作業原則
The 4L 1+N+1 HDI Wifi Module operates by utilizing high-frequency signals transmitted via its integrated antenna to connect to Wi-Fi networks. The module’s HDI design allows for efficient signal routing and minimal interference, ensuring robust and stable connectivity.
アプリケーション
This versatile module is suitable for a wide range of applications including but not limited to:
- 産業機器: Automation systems, control panels.
- Communication Devices: ルーター, access points, set-top boxes.
分類
The module falls under the category of high-density interconnect printed circuit boards, specifically tailored for applications requiring compact size and high performance.
材料構成
Constructed from FR-4, a flame-retardant glass-reinforced epoxy laminate, the module ensures excellent thermal and electrical properties. The copper layers provide conductive pathways essential for signal transmission.
性能特性
- 信号の完全性: Maintains high signal integrity due to minimized trace lengths and optimized layer stack-up.
- 熱管理: Efficient heat dissipation thanks to the material properties of FR-4 and the design architecture.
- 耐久性: Enhanced durability with surface treatments like immersion gold and OSP, protecting against oxidation and improving solder joint reliability.
構造的特徴
- Quadrilateral Foramen: A specialized process involving the creation of square-shaped holes, allowing for intricate component placement and routing.
- レイヤースタックアップ: The unique 1+N+1 layer arrangement optimizes space utilization and signal integrity.
製造工程
The manufacturing process involves several key steps:
- 材料の準備: Cutting and preparing the FR-4 substrate.
- 銅ラミネート: Applying copper layers on both sides and inner layers as per design.
- エッチング: Removing excess copper to form the desired circuit patterns.
- レイヤーの配置: Stacking and aligning the layers accurately.
- ボンディング: 熱と圧力を使用して層を結合します.
- 表面処理: Applying immersion gold and OSP finishes.
- 品質管理: Conducting thorough inspections and tests to ensure product quality
ユースケースシナリオ
家電
In smartphones and tablets, the 4L 1+N+1 HDI Wifi Module ensures reliable wireless connectivity while maintaining a slim profile.
産業機器
For automation systems, the module provides dependable communication links in harsh industrial environments.
Communication Devices
In routers and access points, the module enhances network performance with its superior signal handling capabilities.
By adhering to these design and production standards, the 4L 1+N+1 HDI Wifi Module delivers exceptional performance and reliability, making it an ideal choice for modern electronic applications.