50-レイヤーはプローブカードPCBを食べました

Introduction to UGPCB’s ATE Probe Card PCB

UGPCB’s 50-layer ATE (Automated Test Equipment) Probe Card プリント基板 is a precision-engineered solution designed for high-frequency semiconductor testing. It enables accurate signal transmission between test equipment and integrated circuits (IC), ensuring reliable performance in mission-critical environments.

Key Technical Specifications

• レイヤー数: 50 レイヤー

• 厚さ: 198 ミル

• 材料: FR4 HTg (High-Temperature Glass Epoxy)

• Minimum Hole Size: 5 ミル

• BGA Spacing: 0.35mm

• Aspect Ratio: 40:1

• Drill-to-Copper Distance: 3 ミル

• POFV (Plated Over Filled Via): はい

• Surface Finish: ENEG (Electroless Nickel Electroless Gold)

Design and Structural Innovations

Critical Design Features

1. High-Density Interconnects: The 50-layer architecture supports ultra-fine routing for BGA components with a 0.35mm pitch, essential for modern IC testing.

2. Advanced Material: FR4 HTg ensures thermal stability (Tg ≥ 180°C), preventing deformation during high-power testing cycles.

3. Precision Drilling: あ 40:1 aspect ratio and 5 mil microvias enable reliable signal paths in tightly spaced layouts.

4. POFV Technology: Filled and plated vias enhance mechanical strength and thermal dissipation, critical for prolonged testing operations.

Structural Advantages

• Ultra-Short Drill-to-Copper Distance: 3 mil spacing minimizes signal loss and crosstalk.

• ENEG Surface Finish: Provides exceptional oxidation resistance and stable contact surfaces for probe needles.

Performance and Functional Applications

Operational Principles

The PCB routes electrical signals between test probes and ICs with minimal latency. The FR4 HTg substrate maintains dielectric consistency under thermal stress, while POFV ensures uninterrupted connectivity in high-vibration environments.

Key Performance Metrics

• Thermal Endurance: Stable performance at temperatures up to 180°C.

• 信号の完全性: Controlled impedance (±8%) and low insertion loss (<0.5dB).

• Mechanical Durability: Resists delamination during 10,000+ test cycles.

Primary Use Cases

• Semiconductor Testing: Validates logic chips, メモリモジュール, and processors in ATE systems.

• Aerospace Electronics: Used in avionics testing rigs requiring ultra-reliable PCBs.

• 5G and IoT Device Production: Ensures signal accuracy in high-frequency RF component testing.

• Automotive IC Validation: Deployed in ADAS and ECU testing workflows.

Production Process and Quality Assurance

製造ワークフロー

1. Material Cutting: FR4 HTg laminates are precision-cut to required dimensions.

2. レーザー穴あけ加工: Achieves 5 mil holes with a 40:1 aspect ratio using CO₂ lasers.

3. Plating and Via Filling: POFV technology reinforces vias with copper plating.

4. Layer Alignment: 50-layer stackup is bonded under high pressure and temperature.

5. 表面処理: ENEG coating is applied for corrosion resistance.

6. Rigorous Testing: Includes electrical continuity checks, impedance testing, and thermal cycling validation.

Quality Standards

• IPC-6012 Class 3 Compliance: Guarantees reliability for harsh industrial applications.

• 100% 自動光学検査 (あおい): Detects micro-defects in high-density layouts.

Summary of Competitive Advantages

• Ultra-High Density: Supports miniaturized IC testing with 0.35mm BGA spacing.

• Thermal Resilience: FR4 HTg ensures stability in extreme conditions.

• Industry-Leading Precision: 5 mil microvias and 3 mil drill-to-copper spacing.

• Broad Compatibility: Compatible with major ATE platforms like Teradyne and Advantest.

This PCB combines cutting-edge engineering, stringent quality controls, and specialized materials to meet the demands of next-generation semiconductor testing.