58-レイヤーはPCB回路基板を積みました

Introduction to the 58-Layer ATE Load PCB

The 58-layer ATE (Automated Test Equipment) Load PCB is a high-density, 多層 プリント基板 engineered for precision signal transmission and durability in demanding testing environments. Designed with advanced parameters, it ensures optimal performance in high-frequency and high-power applications.

Key Specifications

• レイヤー: 58

• 寸法: 17.2″ x 17.8″

• 厚さ: 230 ミル

• 材料: FR4 Tg185

• Minimum Hole Size: 5 ミル

• BGA Spacing: 0.8 mm

• Aspect Ratio: 23.4:1

• Drill-to-Copper Distance: 7 ミル

• POFV (Plated Over Filled Via): はい

• Back Drilling: No

• Surface Finish: ENEG+TG+ENIG

Design and Structural Features

Critical Design Considerations

1. High Layer Count: The 58-layer structure supports complex routing for high-density interconnects (HDI), minimizing signal loss.

2. 材料の選択: FR4 Tg185 ensures thermal stability (up to 185°C glass transition temperature), critical for high-power applications.

3. Precision Drilling: あ 5 mil minimum hole size and 23.4:1 aspect ratio enable reliable microvia formation, essential for BGA (0.8 MMピッチ) component integration.

4. 信号の完全性: Controlled impedance and 7 mil drill-to-copper spacing reduce crosstalk and electromagnetic interference (エミ).

Unique Structural Advantages

• POFV Technology: Enhances via reliability by filling and plating vias, improving thermal and mechanical performance.

• ENEG+TG+ENIG Surface Finish: Combines electroless nickel electroless gold (ENEG) and immersion gold (同意する) for superior corrosion resistance and solderability.

Performance and Applications

Operational Principles

The PCB facilitates precise electrical signal routing across 58 レイヤー, leveraging FR4 Tg185’s dielectric properties to maintain signal integrity. POFV ensures robust connections in high-stress environments, while the optimized aspect ratio supports stable high-frequency operations.

Key Performance Metrics

• Thermal Resistance: Withstands temperatures up to 185°C.

• Mechanical Stability: High Tg material prevents delamination under thermal cycling.

• Signal Speed: Low-loss dielectric material minimizes latency.

Primary Use Cases

• Automated Test Equipment (食べた): Used in semiconductor testing systems for validating ICs and microprocessors.

• Aerospace and Defense: Deployed in radar and communication systems requiring high reliability.

• Telecommunications: Supports 5G infrastructure and high-speed data transmission.

• カーエレクトロニクス: Integrated into ADAS (高度なドライバー支援システム) and EV power modules.

Production Process and Quality Assurance

製造ワークフロー

1. 材料の準備: FR4 Tg185 laminates are cut to 17.2″ x 17.8″ dimensions.

2. レーザー穴あけ加工: Creates 5 mil microvias with a 23.4:1 aspect ratio.

3. Plating and Filling: POFV technology applies copper plating to filled vias.

4. Layer Stackup: 58 layers are aligned and bonded under high pressure.

5. 表面仕上げ: ENEG+TG+ENIG coating is applied for corrosion protection.

6. テスト: Electrical continuity, インピーダンス, and thermal stress tests are performed.

Quality Control Standards

• IPC-6012 Class 3: Ensures reliability for harsh environments.

• インピーダンス制御: ±10% tolerance maintained.

Summary of Advantages

• High-Density Design: Supports complex circuitry in compact spaces.

• Thermal Resilience: FR4 Tg185 ensures stability under extreme conditions.

• Precision Engineering: 5 mil holes and 0.8mm BGA spacing enable miniaturized component integration.

• Versatile Applications: From semiconductor testing to 5G infrastructure.

This PCB combines cutting-edge design, rigorous manufacturing standards, and robust materials to meet the needs of mission-critical industries.