62-レイヤーはロードPCBボードを食べました

Overview of the 62-Layer ATE Load PCB

The 62-Layer ATE Load PCB is a high-performance, ultra-high-density プリント基板 engineered for Automated Test Equipment (食べた) システム. Designed to handle complex signal routing and high-power loads, it meets rigorous testing requirements in semiconductor manufacturing and advanced electronics validation.

Key Definition

An ATE Load PCB is a specialized circuit board that simulates real-world operating conditions for testing integrated circuits (IC) そして electronic components. The 62-layer configuration supports intricate signal paths, power distribution, and thermal management in compact designs.

Critical Design Parameters

• レイヤー数: 62 layers for multi-domain signal isolation and power plane optimization.

• 寸法: 16.9″ × 22.9″ (large format for multi-device integration).

• 厚さ: 250 ミル (balances rigidity and thermal dissipation).

• 材料: FR4 HTg (high-temperature glass epoxy for stability up to 180°C).

• Minimum Hole Size: 8 ミル (supports high-density interconnects).

• BGA Pitch: 0.65mm (enables fine-pitch component mounting).

• Aspect Ratio: 32:1 (ensures reliable plating in microvias).

• Drill-to-Copper: 7 ミル (prevents short circuits).

• POFV & Back-Drilling: Eliminates signal distortion in high-frequency applications.

• Surface Finish: ENEG (Electroless Nickel Electroless Gold for corrosion resistance).

Core Functionality

The プリント基板 routes test signals between ATE systems and devices under test (DUTs), ensuring accurate voltage/current measurements. Back-drilling removes unused via stubs to minimize signal reflections, while POFV (Plated Over Filled Vias) enhances thermal conductivity and structural integrity.

主要なアプリケーション

• Semiconductor Testing: Validates ICs, CPU, and memory modules.

• 航空宇宙 & Defense: Mission-critical avionics and radar systems.

• Telecom Infrastructure: High-speed data transmission equipment.

• 医療機器: Precision diagnostic and imaging tools.

Material Advantages

FR4 HTg provides:

• Thermal Resilience: Stable performance under cyclic thermal stress.

• 低誘電損失: Critical for high-frequency signal integrity.

• 機械的強度: Resists warping during multilayer lamination.

構造的特徴

• Hybrid Stackup: Combines high-speed, power, and ground layers.

• Microviaテクノロジー: Laser-drilled microvias (8 ミル) enable dense interlayer connections.

• Controlled Impedance Traces: Minimizes crosstalk in 0.65mm BGA layouts.

Performance Highlights

• 信号の完全性: <3% insertion loss at 10 GHz.

• Power Handling: Supports 20A per power plane.

• 熱管理: 1.2 W/mK thermal conductivity via POFV.

製造ワークフロー

1. Material Prep: Cut FR4 HTg cores and prepreg sheets.

2. レーザー穴あけ加工: Create 8-mil microvias with ±1 mil tolerance.

3. メッキ & POFV: Electroplate vias and fill with conductive epoxy.

4. Back-Drilling: Remove excess via stubs using depth-controlled drills.

5. ラミネート加工: Press 62 layers under high temperature/pressure.

6. Surface Finish: Apply ENEG for solderability and oxidation resistance.

7. テスト: Validate impedance, continuity, and thermal cycling.

Ideal Use Cases

• High-Frequency ATE Systems: Tests 5G RF components and millimeter-wave devices.

• Multi-Site Testing: Parallel validation of 16+ DUTs on a single board.

• Harsh Environments: Oil/gas exploration sensors and automotive ECU testing.