0.22mm超薄型6層HDIリジッドフレックスPCBメーカー | UGPCB

UGPCB’s 0.22mm Ultra-Thin 6-Layer HDI Rigid-Flex PCB 製品の概要

In the pursuit of extreme device miniaturization and high reliability, traditional rigid プリント基板 (プリント基板) are often insufficient. UGPCB combines advanced 高密度相互接続 (HDI) そして リジッドフレックス technologies to present our flagship product: の 0.22mm Ultra-Thin 6-Layer HDI Rigid-Flex PCB. This board is a pinnacle of プリント基板の製造 そしてa high-performance interconnect solution engineered for wearable technology, advanced medical instruments, 航空宇宙, and premium consumer electronics. It seamlessly merges the stable support of rigid boards with the dynamic bending capability of flexible circuits, enabling complex electrical connections within minimal space.

Product Definition & Scientific Classification

This is a high-layer-count PCB 活用する 任意の層HDI そして rigid-flex construction. It can be accurately classified per industry standards:

• 構造によって: リジッドフレックス PCB – Laminates rigid and flexible circuit layers into a single unit.

• By Technology Level: Advanced HDI PCB – Employs laser drilling, filled vias, and microvias (<0.15mm) for superior routing density.

• レイヤーカウントごとに: 6-Layer Circuit Board (comprising both rigid and flexible layers).

• 素材によって: Specialty High-Performance Material PCB – Core build-up uses Panasonic RF-777 composite.

Design Essentials & 作業原則

Design Essentials: The key to a successful rigid-flex board design lies in the rigid-to-flex transition zone. Precise calculation of bend radius, stress relief, and routing in flex areas is critical to prevent cracking during dynamic flexing. 同時に, HDI blind and buried via design must coordinate with the stack-up structure to optimize signal integrity (そして) and power integrity (PI).
作業原則: The プリント基板の構造 integrates rigid sections (for component mounting and mechanical support) with flexible sections (for 3D interconnection and movement) 経由 多層ラミネート. Electrical signals travel through laser-drilled microvias そして via filling plating technologies inherent to HDIボード, achieving the shortest and most reliable paths between layers, which minimizes signal loss and crosstalk.

コア材料 & Superior Performance

• コア素材: We utilize the industry-premium Panasonic RF-777 35/50 複合材料. Renowned for its exceptional 寸法安定性, superior high-frequency performance, and excellent 耐熱性, it is the ideal choice for manufacturing high-reliability rigid-flex circuit boards.

• 表面仕上げ: The board features a 2-micron Electroless Nickel Immersion Gold (同意する) finish. This provides a flat surface, 優れたはんだ付け性, and long-term oxidation resistance for PCB pads, making it perfect for mounting ファインピッチ部品 like BGAs.

• Key Performance Attributes:

  • Ultra-Thin 0.22mm Profile: Enables maximum compression of internal device space.

  • 高い信頼性: Undergoes rigorous PCB reliability testing, capable of withstanding millions of dynamic bend cycles.

  • Excellent Signal Transmission: HDI設計 and premium materials ensure low-loss transmission for high-speed signals.

  • High-Density Assembly: Provides an ideal platform for SMTアセンブリ, supporting miniaturized component layout.

構造 & 主な特長

• PCB Structure: A typical 6-layer construction involving 2-4 layers of rigid FR-4 laminated with polyimide flexible cores. The 積み上げ is meticulously engineered to balance stiffness and flexibility.

• 製品の特徴:

  1. 3D Interconnection Freedom: Eliminates spatial constraints, enabling 3D assembly and reducing connectors and cables.

  2. 軽量 & Miniaturization: The extreme thinness directly reduces product weight and size.

  3. Enhanced System Reliability: Removes connection point failures, improving overall stability in vibrating or high-shock environments.

  4. Simplified Assembly Process: として custom PCBアセンブリ, it streamlines final product assembly, lowering labor costs.

Precision Manufacturing Process

UGPCB adheres to international quality standards like IPC-6013 (for flexible circuits) そして IPC-2221/2223. 私たちの PCB fabrication process is precise and rigorous:

1. レーザー穴あけ加工: Creates micron-level blind and buried vias in flexible and core layers.

2. ホールメタライゼーション & メッキ: Vias are made conductive through chemical deposition and plating, と via filling for planarization.

3. Pattern Transfer & エッチング: Forms the intricate circuit board traces.

4. レイヤーの配置 & ラミネート加工: Rigid layers, プリプレグ, and flexible layers are precisely aligned and bonded under high heat and pressure. This is the core step in rigid-flex PCB manufacturing.

5. 表面仕上げ: の適用 同意する coating to protect pads and ensure solderability.

6. 厳格なテスト: Includes 飛行プローブ試験, 自動光学検査 (あおい), and reliability testing to ensure every board’s quality.

Wide-Ranging Application Scenarios

これ advanced PCB is the core skeleton for innovative products in:

• ウェアラブルテクノロジー: スマートウォッチ, AR/VR glasses, health monitors, requiring comfort and constant flexing.

• Advanced Medical Electronics: Endoscopic capsules, hearing aids, portable monitors, demanding high reliability and miniaturization.

• 航空宇宙 & 防衛: Satellite components, UAV flight control systems, needing extreme environment endurance and low weight.

• Precision Consumer Electronics: High-end smartphone camera modules, folding phone hinge areas, ultra-thin laptops.

• 産業用 & カーエレクトロニクス: Compact sensors, robotic joint interconnection modules.

Contact a UGPCB PCB Technical Expert today for your 0.22mm Ultra-Thin HDI Rigid-Flex PCB solution! Make your product stand out in the competition for miniaturization and high performance.