1.6mm高熱FR-4アルミニウムベースPCB | 片面ENIG 2u" | LEDヒートシンクボード - UGPCB

High-Thermal FR-4 Single-Side Aluminum Base PCB Product Overview & 意味

In today’s high-power, high-density electronic devices, の thermal management capability of a プリント基板 (プリント基板) is critical for product reliability and longevity. UGPCB 1.6mm Single-Side Aluminum Base PCB (1 Layer Aluminum Core PCB) is an innovative solution that combines a high-Tg FR-4 laminate with an integrated thermal management structure. This design achieves an optimal balance between the excellent electrical properties of FR-4, 費用対効果, and heat dissipation performance comparable to dedicated Metal Core PCBs (MCPCB). これ Thermal Management PCB is specifically engineered to solve cooling challenges in applications like LED lighting and power conversion modules.

High-Thermal FR-4 Single-Side Aluminum Base PCB

コア仕様 & 技術分類

レイヤー数: 1 層 (Single-Sided PCB)
板厚: 1.6mm (標準, robust)
Base Laminate Material: FR-4, ガラス転移温度 (TG) ≥ 150°C (High Tg FR-4 PCB)
Thermal Structure: Integrated Aluminum Base Layer/Block (Metal Core PCB)
表面仕上げ: エレクトロレスニッケルイマージョンゴールド (同意する), 2 micro-inches Gold Thickness (約. 0.05μm)
Legend/Silkscreen: White LPI Solder Mask, Black Text (High contrast for clear identification)

Scientific Classification:

レイヤーカウントごとに: Single-Sided Board.
By Substrate Type: Rigid Composite Metal Core Printed Circuit Board.
By Thermal Performance: High Thermal Conductivity PCB.
By Primary Application: High-Power LED Heat Sink Board, Power Supply Cooling Board.

設計ガイドライン & 動作原理

設計上の重要な考慮事項:

Heat Source Placement: High-heat-dissipation components (例えば。, LED chips, power MOSFETs) should be placed on pads directly connected to or in close proximity to the aluminum base thermal pad area to ensure the shortest thermal path.
Electrical Isolation: Although it features a metal base, electrical isolation between the circuit and the metal core is maintained through the FR-4 dielectric layer そしてa thermally conductive insulating layer. Design must ensure the required insulation withstand voltage (通常 >2kV) is met.
Copper Weight Selection: Choose appropriate copper foil thickness (standard 1oz/2oz) based on current-carrying requirements. Widen traces or use copper pours for high-current paths.
ENIG Finish Advantage: The 2u” ENIG表面仕上げ provides excellent flatness and solderability, ideal for fine-pitch SMT components and connectors subject to repeated mating cycles.

動作原理:

The core functionality of this PCBボード is to utilize the high thermal conductivity of aluminum (約. 200 w/m・k) to rapidly absorb and spread heat generated by components on the circuit layer. The heat is then dissipated into the environment via the chassis or an external heatsink attached to the board. The structure acts as a “thermal highway,” conducting heat from localized hotspots across the entire metal base area, significantly lowering junction temperatures and enhancing system stability.

材料, 工事 & 主な特長

使用材料:

回路層: Electro-Deposited (編) 銅箔
Dielectric/Insulating Layer: High-Tg FR-4 Epoxy Glass Laminate (TG 150)
Thermal Core Layer: Aluminum Alloy Plate (通常 5052 または 6061)
表面仕上げ: エレクトロレスニッケルイマージョンゴールド (/または)
Legend Ink: High-Temperature Resistant White LPI Solder Mask, Black Legend Ink

Board Construction:

The stack-up, from top to bottom, は: White Solder Mask Layer (with Black Legend) -> 2u” ENIG Pads/Traces Layer -> FR-4 Dielectric Insulation Layer -> Aluminum Metal Substrate. これ “sandwich” construction ensures optimal electrical performance alongside superior thermal management.

Core Performance & 特徴:

Superior Heat Dissipation: Integrated aluminum core provides thermal conductivity far exceeding standard FR-4 PCB boards, effectively reducing component operating temperatures by 20%-40%.
高い信頼性: The FR-4 TG150 material offers enhanced thermal endurance, maintaining mechanical stability in high-temperature environments and minimizing solder joint fatigue from CTE mismatch.
優れたはんだき性: The エレクトロレスニッケルイマージョンゴールド (同意する) finish アパートを提供します, oxidation-resistant, and highly solderable surface, ファインピッチ部品に最適.
Mechanical Robustness: The 1.6mm overall thickness combined with the metal core results in a PCBボード with higher mechanical strength, resisting bending and vibration.
Clear Identification: The white-on-black legend printing offers excellent readability during assembly and servicing.
Cost-Effective Solution: Compared to full ceramic substrates or high-end pure aluminum PCBs, this solution provides superior thermal performance while maintaining a competitive プリント基板の製造 料金.

製造工程 & Key Techniques

UGPCB strictly adheres to IPC標準. The core manufacturing workflow is as follows:

Panelization & Prep: Cutting the FR-4 and aluminum core laminate material.
イメージング & Pattern Transfer: Transferring the circuit pattern onto the copper layer via photolithography.
エッチング: Forming precise copper traces.
掘削 (if required): For mounting holes or thermal vias.
はんだマスク & Legend Application: Coating with white LPI solder mask, followed by exposure, 発達, and printing of black legend.
表面仕上げ: Applying a precisely controlled Electroless Nickel Immersion Gold process to create nickel and gold layers on exposed pads, ensuring a consistent gold thickness of 2 micro-inches.
Routing & Profiling: Board outline routing or V-scoring.
電気試験 & 最終検査: 100% Flying Probe or Fixture testing to ensure circuit continuity and electrical isolation.

主要なアプリケーション & ユースケース

これ High-Thermal Single-Side Aluminum Core PCB is the ideal choice for a wide range of medium-to-high power electronic applications requiring efficient cooling:

LED Lighting: LED Heat Sink Boards (PCB MCPCBs) for high-power LED street lights, industrial lamps, and automotive lighting, significantly extending LED lifespan by mitigating lumen depreciation.
電源モジュール: Switching Mode Power Supplies (SMPS), DC-DCコンバーター, and power sections of motor drivers.
カーエレクトロニクス: Power management systems and LED controller boards in new energy vehicles.
家電: High-end audio amplifiers, power amplifier modules in routers.
産業用制御: IGBT heatsink substrates in variable frequency drives and servo drives.

High-Thermal FR-4 Single-Side Aluminum Base PCBs are a primary application scenario in high-end audio amplifiers.

Why Choose UGPCB’s Aluminum Base PCB Solution?

As a professional PCBメーカー, UGPCB not only supplies standard products but also offers customization based on your specific thermal requirements (例えば。, locally thickened aluminum base), electrical insulation needs, and mechanical form factors. We are committed to supporting your project from initial design review through to volume production, 保証 PCBボード quality and on-time delivery.

今すぐお問い合わせください for a free quote and technical consultation on your High-Power Thermal Management PCB Solution. Let our expert design and manufacturing capabilities enhance the reliability and performance of your products.